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A substrate-free, pressure-sensitive adhesive technology, used in pressure-sensitive films/sheets, adhesives, film/sheet-like adhesives, etc., to solve problems such as incomplete removal, contamination by stickers, and strong insensitivity , to achieve a good user experience
Inactive Publication Date: 2021-01-29
ZHONGSHAN TAILI HOUSEHOLD PROD MFG
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Problems solved by technology
During the removal process of pressure-sensitive adhesives with substrates, because the physical properties of the substrates are extremely difficult to match the physical parameters of the pressure-sensitive adhesives, especially the tensile strength of the substrates and adhesives further affects the above balance. Causes a strong sense of sluggishness during disassembly, resulting in incomplete removal
Especially under low temperature conditions, it lacks good cohesive strength. During the removal process, it is easy to produce residual glue, damage the pasted object, and cause the pasted object to be polluted
Method used
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Embodiment 1
[0020]40 parts of SIS, 12 parts of 4010, 40 parts of terpene resin, 4 parts of rosin glycerides, 1 part of nano silica, 1682 parts of antioxidants, 10102 parts of antioxidants. The relative molecular weight of elastomer SIS is 10×104, S / I block ratio is 20%.
[0021]The preparation steps of the above pressure-sensitive adhesive are:
[0022]1) Glue making: under the protection of nitrogen, first add the formula amount of naphthenic oil, elastomer and antioxidant into the reactor, control the material temperature at 180-200℃, stir at the speed of 120r / min to melt, and then add Rosinglyceride, terpene resin and nano-silica were stirred for 2 hours until it became transparent and then continued stirring for 0.5 hours.
[0023]2) Coating: Pour the pressure-sensitive adhesive into the glue box of the hot melt pressure-sensitive adhesive coatingmachine. The glue box maintains a constant temperature of 180°C, the temperature of the hose is 170°C, the coating temperature is 175°C, and the multilay...
Embodiment 2
[0025]20 parts of SIS, 5 parts of 4010, 20 parts of terpene resin, 1 part of rosinglyceride, 0.2 part of nano-silica, 168 1 part of antioxidant, and 1010 1 part of antioxidant. The relative molecular weight of elastomer SIS is 12×104, S / I block ratio is 20%.
[0026]The preparation steps of the pressure-sensitive adhesive are the same as in Example 1.
Embodiment 3
[0028]SIS 75 parts, 4010 40 parts, terpene resin 60 parts, rosin glyceride 10 parts, nano silica 1.5 parts, antioxidant 168 4 parts, antioxidant 10104 parts. The relative molecular weight of elastomer SIS is 8×104, S / I block ratio is 20%.
[0029]The preparation steps of the pressure-sensitive adhesive are the same as in Example 1.
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Abstract
The invention discloses a substrate-free removable rubber pressure-sensitive adhesive and a preparation method thereof. The pressure-sensitive adhesive is prepared from the following raw materials inparts by weight: 20-75 parts of elastomer SIS, 20-60 parts of terpene resin, 1-10 parts of glycerol ester of rosin, 5-40 parts of naphthenic oil, 0.2-1.5 parts of nano silicon dioxide (with the diameter of 20-100nm) and 1-8 parts of an antioxidant. The relative molecular weight of the elastomer SIS is 8 * 10 < 4>-12 * 10 < 4 >, and the S / I block ratio is 20%. The pressure-sensitive adhesive is prepared through adhesive preparation and coating. The pressure-sensitive adhesive is free of base materials, stable in adhesive force, easy to remove at low temperature, free of residual adhesive and free of polluting an attached object.
Description
Technical field[0001]The present invention relates to the field of polymer materials, in particular to a substrate-free removable rubber pressure sensitive adhesive.Background technique[0002]With the development of science and technology, more and more products have developed in the direction of modularity, repeatable disassembly and installation from the beginning of design, and more and more use double-sided tape for fixing. For example, the use of vertical space in the home and the fixing of electronic and electrical components require the use of pressure sensitive adhesive. Pressure-sensitive adhesive not only needs to have a certain degree of adhesion, but also needs to have enough cohesion to meet its own mobility requirements.[0003]The design of pressure-sensitive adhesive seeks a balance between fluidity and fluidity resistance. The formation of the adhesive is because the adhesive is soft enough to flow and wet the adherend, which requires the pressure-sensitive adhesive to...
Claims
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