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Back plate, preparation method thereof, backlight module and display device

A technology of backplane and photoresist, which is applied in the direction of photolithographic exposure device, optics, and optomechanical equipment, etc., can solve the problems of increasing the production cost of thick copper metal wiring, copper oxidation, and increasing the resistance of copper metal wiring, etc. Achieve the effects of improving bonding yield, avoiding oxidation, and reducing the number of times of heating and curing

Active Publication Date: 2021-02-02
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When sputtering equipment is used to make 3um thick copper metal traces, three mask exposure processes are required, which greatly increases the production cost of thick copper metal traces, and each resin layer needs a certain temperature and time to cure. Oxidation of copper will be caused during the curing process of the layer, increasing the resistance of copper metal traces

Method used

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  • Back plate, preparation method thereof, backlight module and display device
  • Back plate, preparation method thereof, backlight module and display device
  • Back plate, preparation method thereof, backlight module and display device

Examples

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no. 1 example

[0072] figure 2 It is a schematic diagram of the preparation method of the backplane of the embodiment of the present invention. The preparation method of the backboard includes:

[0073] S1: using a mask exposure process to form an insulating structure layer with grooves on the substrate, the grooves are used to accommodate metal wiring;

[0074] S2: repeating the step of forming the sub-metal layer including the ashing process and the wet etching process multiple times to form the metal wiring in the trench.

[0075] In one embodiment, the sidewalls of the trench are perpendicular to the surface of the substrate.

[0076] In one embodiment, the depth of the trench is greater than 3um.

[0077] In one embodiment, the step of forming the sub-metal layer includes:

[0078] depositing a metal film on the substrate formed with the trench;

[0079] forming a photoresist layer with a flat surface on the metal thin film;

[0080] Performing ashing treatment on the photoresist...

no. 2 example

[0126] The second embodiment of the present invention proposes a method for preparing a backplane. The difference from the first embodiment is that in the second embodiment, in order to obtain 3um thick copper metal traces, the number of repetitions of the sub-metal layer forming steps is 2 times, therefore, in this embodiment, S2 specifically includes: executing S21-S24 sequentially for the first time, respectively obtaining the following Figure 4a , Figure 4b , Figure 4c , Figure 4d with Figure 4e structure shown. Execute S21~S24 sequentially for the second time, and obtain the following Figure 5a , Figure 5b , Figure 5c , Figure 5d with Figure 5e structure shown.

[0127] Figure 6c-2 , Figure 6d-2 with Figure 6e-2 They are schematic structural diagrams during the process of forming the third sub-metal layer in the second embodiment. In this embodiment, the method for preparing the backplane may further include S3: forming a third sub-metal layer on...

no. 3 example

[0136] Based on the inventive concepts of the foregoing embodiments, the third embodiment of the present invention provides a backlight module. The backlight module includes the backplane formed by the aforementioned embodiments, and also includes Mini-LEDs arranged on the backplane and electrically connected to the metal wires, such as Figure 7 or Figure 8 shown.

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Abstract

The invention discloses a back plate, a preparation method thereof, a back plate module and a display device. The preparation method of the back plate comprises the steps that: an insulating structurelayer with a groove is formed on a substrate through a mask exposure process, and the groove is used for containing a metal wire; and a sub-metal layer forming step comprising ashing treatment and awet etching process is repeated for multiple times to form the metal wire in the groove. According to the preparation method of the back plate, only one mask exposure process is needed in the processof forming the metal wire, so that the process flow of preparing the metal wire is simplified, the mask exposure frequency is reduced, the manufacturing cost of the metal wire is reduced, and the manufacturing cost of the backlight module and the manufacturing cost of the display device are reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a backplane, a preparation method thereof, a backlight module and a display device. Background technique [0002] Mini-LED refers to LEDs used for display applications with a size between 80mm and 300um, also known as submillimeter light-emitting diodes. There are two main applications of Mini-LED in display. One is as a self-luminous LED display. Compared with small-pitch LEDs, on the same chip size, Mini-LED can be used for smaller dot-pitch displays. The other is applied to the LCD backlight. Compared with the traditional side-type LED backlight module, the direct-type Mini-LED backlight module can reduce the light mixing distance by adopting a more dense chip arrangement, and achieve an ultra-thin light source module. In addition, with local dimming control, Mini-LED will have better contrast and high dynamic range image (High-Dynamic Range, HDR) display effect. The LCD d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027H01L33/62G03F7/20
CPCH01L21/0274H01L33/62G03F7/2022G03F7/70058H01L2933/0066H01L2224/81385H01L2224/13294H01L2224/133H01L2224/13339H01L2224/1329H01L24/13H01L24/16H01L2224/16237H01L2224/16227H01L2224/16112H01L2224/1601H01L2924/12041H01L2224/10175H01L23/49811H01L21/4853H01L23/49866H01L2924/3841H01L2924/00014H01L2924/014H01L2924/00012H01L2224/16225
Inventor 梁志伟罗雯倩刘英伟王珂班圣光曹占锋
Owner BOE TECH GRP CO LTD
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