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Adhesive tape for semiconductor processing and method for producing semiconductor device

A semiconductor and tape technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of chip cracks, breakage, chip defects, etc., and achieve the effect of reducing cracks

Active Publication Date: 2021-02-05
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the chip finishing thickness is reduced to 30 μm or less using the adhesive tapes described in Patent Documents 1 and 2, chips may be chipped or broken (hereinafter sometimes referred to as "chip cracks").

Method used

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  • Adhesive tape for semiconductor processing and method for producing semiconductor device
  • Adhesive tape for semiconductor processing and method for producing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0251] (1) Substrate

[0252] As a base material, a PET film (COSMOSHINE A4300 manufactured by TOYOBO CO., LTD., COSMOSHINE A4300, thickness: 50 μm, Young’s modulus at 23° C.: 2550 MPa, breaking energy: 55.3 MJ / m was prepared as a substrate. 3 ).

[0253] (2) buffer layer

[0254] (Synthesis of urethane acrylate oligomer)

[0255] Polyester diol is reacted with isophorone diisocyanate to obtain a terminal isocyanate urethane prepolymer, and 2-hydroxyethyl acrylate is reacted with the prepolymer to obtain a weight average molecular weight (Mw) of about 16000 Urethane acrylate oligomer (UA-2).

[0256] (Preparation of composition for buffer layer formation)

[0257] Blending 20 parts by mass of the urethane acrylate oligomer (UA-2) synthesized above, 20 parts by mass of isobornyl acrylate (IBXA), 30 parts by mass of tetrahydrofurfuryl acrylate (THFA) and 4- 30 parts by mass of acryloylmorpholine (ACMO), further blended with 2-hydroxy-2-methyl-1-phenyl-propan-1-one (manufact...

Embodiment 2

[0269] In the synthesis of the urethane acrylate oligomer of the buffer layer, a urethane acrylate oligomer (UA-3) with a weight average molecular weight (Mw) of about 20,000 was obtained, which is used for buffer layer formation. In preparation of the composition, it obtained the adhesive tape similarly to Example 1 except having changed into 20 mass parts of urethane acrylate oligomers (UA-3).

Embodiment 3

[0271] In preparing the buffer layer forming composition, 25 parts by mass of urethane acrylate oligomer (UA-2), 30 parts by mass of tetrahydrofurfuryl acrylate (THFA) and 4-acryloyl 45 parts by mass of phenoline (ACMO), further blended with 2-hydroxyl-2-methyl-1-phenyl-propan-1-one (manufactured by BASF JAPAN, product name "IRGACURE 1173") as a photopolymerization initiator 2.0 The pressure-sensitive adhesive tape was obtained in the same manner as in Example 1, except that the composition for buffer layer formation was prepared.

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Abstract

[Problem] To provide an adhesive tape for semiconductor processing, which is capable of suppressing cracks of a chip even if used in DBG or LDBG. [Solution] An adhesive tape for semiconductor processing, which comprises a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23DEG C and a rupture energy of 1-9 MJ / m3; and the Young's modulus of the base material at 23DEG C is higher than the above-mentioned Young's modulus of the buffer layer.

Description

technical field [0001] The present invention relates to an adhesive tape for semiconductor processing. More specifically, it relates to an adhesive tape that is used when grooves are provided on the surface of a wafer or a modified region is provided inside the wafer with a laser, and the stress of the back grinding of the wafer is utilized. When manufacturing a semiconductor device by singulation of a wafer, etc., an adhesive tape for temporarily holding a semiconductor wafer or a chip, and a method of manufacturing a semiconductor device using the adhesive tape are preferable. Background technique [0002] Along with progress in miniaturization and multifunctionalization of various electronic devices, miniaturization and thinning of semiconductor chips mounted therein are also required. In order to reduce the thickness of the chip, the back surface of the semiconductor wafer is usually polished to adjust the thickness. In addition, in order to obtain thinned chips, a tech...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/29B32B27/00C09J201/00H01L21/301H01L21/304
CPCH01L21/6836H01L2221/68381H01L2221/68327H01L23/562C09J7/29C09J2301/312C09J2203/326B32B27/281B32B2270/00B32B2457/14B32B27/16B32B27/308B32B27/40B32B27/22B32B27/306B32B7/022B32B2405/00B32B27/18B32B2307/54B32B27/34B32B27/365B32B2307/732B32B27/286B32B27/36B32B27/285B32B27/325B32B27/288B32B2250/24B32B27/32B32B27/08B32B27/20C09J7/38C09J201/00H01L21/304C09J7/385C09J2433/006C09J2467/006C09J2475/006H01L21/78
Inventor 爱泽和人前田淳
Owner LINTEC CORP