Process for preparing high-compactness tungsten-copper alloy metal materials by utilizing tungsten powder

A tungsten-copper alloy and metal material technology, applied in metal material coating technology, metal processing equipment, liquid chemical plating and other directions, can solve the problems of low densification degree and difficult sintering of tungsten-copper alloy, and achieve uniform composition distribution, Good high temperature oxidation resistance and ablation resistance, the effect of improving comprehensive performance

Active Publication Date: 2021-02-12
SHAANXI SIRUI ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention solves the shortcomings of difficult sintering and low densification of tungsten-copper alloy

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0032] A process for preparing a high-density tungsten-copper alloy metal material by using tungsten powder, comprising the following steps:

[0033] (1) Disperse the tungsten powder into the copper plating solution, and pre-plate copper by electroless plating; then transfer the tungsten powder after pre-copper plating to CuSO 4 Copper electroplating is carried out in acidic electroplating solution, and post-treatment is carried out after electroplating to obtain copper-clad tungsten composite powder;

[0034] The particle size of the tungsten powder is 8μm, and the tungsten powder is ball milled for 0.5h before electroless copper plating, so that the agglomerated tungsten powder is fully dispersed;

[0035] Pre-plating copper by electroless plating: adjust the pH value to 14, the temperature is 40°C, and the pre-plating time is 40 minutes; the pre-plating solution used includes CuSO 4 , reducing agent, chelating dispersant, stabilizer, surfactant, promotor, acid-base reconci...

Embodiment 2

[0046] A process for preparing a high-density tungsten-copper alloy metal material by using tungsten powder, comprising the following steps:

[0047] (1) Disperse the tungsten powder into the copper plating solution, and pre-plate copper by electroless plating; then transfer the tungsten powder after pre-copper plating to CuSO 4 Copper electroplating is carried out in acidic electroplating solution, and post-treatment is carried out after electroplating to obtain copper-clad tungsten composite powder;

[0048] The particle size of the tungsten powder is 1 μm, and the tungsten powder is ball-milled for 2 hours before electroless copper plating, so that the agglomerated tungsten powder is fully dispersed;

[0049] Pre-plating copper by electroless plating: adjust the pH value to 10, the temperature is 60°C, and the pre-plating time is 20 minutes; the pre-plating solution used includes CuSO 4 , reducing agent, chelating dispersant, stabilizer, surfactant, promotor, acid-base rec...

Embodiment 3

[0059] A process for preparing a high-density tungsten-copper alloy metal material by using tungsten powder, comprising the following steps:

[0060] (1) Disperse the tungsten powder into the copper plating solution, and pre-plate copper by electroless plating; then transfer the tungsten powder after pre-copper plating to CuSO 4 Copper electroplating is carried out in acidic electroplating solution, and post-treatment is carried out after electroplating to obtain copper-clad tungsten composite powder;

[0061] The particle size of the tungsten powder is 5 μm, and the tungsten powder is ball-milled for 1 hour before electroless copper plating, so that the agglomerated tungsten powder is fully dispersed;

[0062] Pre-plating copper by electroless plating: adjust the pH value to 12, the temperature is 50°C, and the pre-plating time is 30 minutes; the pre-plating solution used includes CuSO 4 , reducing agent, chelating dispersing agent, stabilizer, surfactant, promotor, acid-bas...

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Abstract

The invention discloses a process for preparing high-compactness tungsten-copper alloy metal materials by utilizing tungsten powder. The process comprises the following steps: (1), dispersing the tungsten powder in copper-plating liquid, and pre-plating copper by adopting an electroless plating method; transferring the tungsten powder subjected to pre-plating of copper into CuSO4 acidic electroplating liquid and performing electro-plating of copper; and performing post-treatment after electro-plating so as to obtain tungsten-in-copper composite powder; (2), pouring the tungsten-in-copper composite powder prepared in the step (1) into a graphite mould, then putting the graphite mould in a discharge plasma sintering furnace, and then performing vacuumizing and pressurizing to obtain a sintered body; and (3), performing hot isostatic pressing resintering on the sintered body in the step (2), and finally obtaining the high-compactness tungsten-copper alloy with the compactness degree beingmore than 99.5 percent. The process disclosed by the invention has the disadvantages of difficult sintering of the tungsten-copper alloys and low compactness degree.

Description

technical field [0001] The invention relates to the technical field of powder preparation of alloy metal materials, in particular to a process for preparing high-density tungsten-copper alloy metal materials by using tungsten powder. Background technique [0002] Tungsten-copper alloy combines the advantages of metal tungsten and copper. Among them, tungsten has the characteristics of high melting point, high arc ablation resistance, high strength and low thermal expansion coefficient. Copper has high electrical conductivity and high thermal conductivity, so it is widely used in medium and high voltage switch contacts. Head materials, military high temperature resistant materials, electrical machining electrodes, electronic packaging materials and heat sink materials. [0003] Tungsten copper electronic packaging material is a two-phase pseudo-alloy composed of low thermal expansion tungsten and high electrical and thermal conductivity copper. Its thermal expansion coefficie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/04C22C27/04B22F1/02B22F3/105B22F3/15C23C18/40C25D3/38
CPCC22C1/045C22C27/04B22F3/105B22F3/15C23C18/405C23C18/1637C23C18/1653C25D3/38B22F2998/10B22F1/17
Inventor 周兴王小军周宁赵俊
Owner SHAANXI SIRUI ADVANCED MATERIALS CO LTD
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