Preparation method of epoxy resin with low dielectric loss

An epoxy resin preparation and epoxy resin technology, which is applied in the field of epoxy resin preparation with low dielectric loss, can solve the problems of component heating, power consumption, affecting normal operation, etc. Effects of Oxygen Resin Properties

Pending Publication Date: 2021-02-19
安徽威能电源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Dielectric loss not only consumes electric energy, but also makes components heat up and affects their normal operation

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A method for preparing an epoxy resin with low dielectric loss. The epoxy resin and a bridging agent are mixed and added into a reaction kettle, and then heated to 135 DEG C under the protection of an inert atmosphere, and the reaction is kept under stirring for 35 minutes, and then stearic acid and stearic acid are added. The diisocyanate mixture was continuously heated to 168°C, kept stirring for 1 hour to obtain an intermediate; the intermediate was dissolved in an organic solvent, and after stirring and dissolving, the nano-additive was added, the temperature was adjusted to 120°C, and the ultrasonic dispersion treatment was carried out for 20 minutes, and then the Rotary evaporation to remove the organic solvent. The preparation method of the bridging agent is as follows: adding triphenylphosphine and acetonitrile in sequence to the reaction kettle, then feeding nitrogen, discharging the air in the reaction kettle, adding 5-bromovaleric acid, adjusting the temperatu...

Embodiment 2

[0045]A method for preparing an epoxy resin with low dielectric loss. The epoxy resin and a bridging agent are mixed and added into a reaction kettle, and then heated to 140 DEG C under the protection of an inert atmosphere, and the reaction is kept under stirring for 40 minutes, and then stearic acid and stearic acid are added. The diisocyanate mixture was continuously heated to 170°C, kept stirring for 1.5 hours to obtain an intermediate; the intermediate was dissolved in an organic solvent, and after stirring and dissolving, the nano-additive was added, the temperature was adjusted to 130°C, and the ultrasonic dispersion treatment was carried out for 25 minutes, and then the Rotary evaporation to remove the organic solvent. The preparation method of the bridging agent is as follows: adding triphenylphosphine and acetonitrile in sequence to the reaction kettle, then feeding nitrogen gas, discharging the air in the reaction kettle, adding 5-bromovaleric acid, adjusting the tem...

Embodiment 3

[0048] A method for preparing an epoxy resin with low dielectric loss. The epoxy resin and a bridging agent are mixed and added into a reaction kettle, and then heated to 137° C. under the protection of an inert atmosphere, and the reaction is maintained and stirred for 38 minutes, and then stearic acid and stearic acid are added. The diisocyanate mixture was continuously heated to 169°C, kept stirring for 1.3 hours to obtain an intermediate; the intermediate was dissolved in an organic solvent, and after stirring and dissolving, nano-additives were added, and the temperature was adjusted to 124°C, and ultrasonically dispersed for 20-25min. Then perform rotary evaporation to remove the organic solvent. The preparation method of the bridging agent is as follows: adding triphenylphosphine and acetonitrile in sequence to the reaction kettle, then feeding nitrogen gas, discharging the air in the reaction kettle, adding 5-bromovaleric acid, adjusting the temperature to 73° C., and k...

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Abstract

The invention discloses a preparation method of epoxy resin with low dielectric loss, and relates to the technical field of epoxy resin. The preparation method comprises the steps of mixing epoxy resin and a bridging agent, adding the mixture into a reaction kettle, heating to the temperature of 135-140 DEG C under the protection of inert atmosphere, carrying out heat preservation and stirring reaction for 35-40 minutes, adding a stearic acid and diisocyanate mixture, continuously heating to the temperature of 168-170 DEG C, and carrying out heat preservation and stirring for 1-1.5 hours to obtain an intermediate; dissolving the intermediate in an organic solvent, stirring to dissolve, adding a nano additive, adjusting the temperature to 120-130 DEG C, carrying out ultrasonic dispersion treatment for 20-25 minutes, and carrying out rotary evaporation to remove the organic solvent, thereby obtaining the product. The performance parameters of the epoxy resin prepared by the method disclosed by the invention are greatly changed.

Description

technical field [0001] The invention belongs to the technical field of epoxy resins, in particular to a preparation method of epoxy resins with low dielectric loss. Background technique [0002] Epoxy resin is a kind of high molecular polymer, the molecular formula is (C11H12O3)n, which refers to the general name of a class of polymers containing more than two epoxy groups in the molecule. It is the polycondensation product of epichlorohydrin and bisphenol A or polyol. Due to the chemical activity of the epoxy group, a variety of compounds containing active hydrogen can be used to open the ring, cure and crosslink to form a network structure, so it is a thermosetting resin. Bisphenol A epoxy resin not only has the largest output and the most complete varieties, but also the new modified varieties are still increasing and the quality is constantly improving. [0003] The excellent physical, mechanical and electrical insulation properties of epoxy resin, its bonding properti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L1/28C08K3/34C08G59/14
CPCC08L63/00C08G59/1488C08G59/1477C08G59/1455C08K2201/011C08L1/286C08K3/346
Inventor 赵强胡孙日
Owner 安徽威能电源科技有限公司
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