Silicon wafer drying device and method

Abstract

The invention discloses a silicon wafer drying device and method. The silicon wafer drying device comprises a texturing basket conveying device, a first buffering cavity, a first low-pressure cavity,a drying cavity, a second low-pressure cavity and a second buffering cavity; the texturing basket conveying device is used for conveying texturing baskets which load silicon wafers and are arranged atequal intervals, the texturing basket conveying device is sequentially provided with the first buffering cavity, the first low-pressure cavity, the drying cavity, the second low-pressure cavity and the second buffering cavity in the conveying direction, the cavities are separated into closed spaces through double side doors, the buffering cavities and the low-pressure cavities are connected witha vacuum system, and a gas filtering reduction system, a heating temperature control system, a gas purging system and a water vapor condensation circulating system are arranged in the drying cavity. By means of the above manner, the textured silicon wafers and the texturing baskets can be dried, silicon wafer surface oxidation caused by water vapor and oxidizing atmosphere in the drying process isavoided, and poor product manufacturing procedures are reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor device production, in particular to a silicon wafer drying device and a method thereof. Background technique [0002] Environmental pollution and energy crisis have become increasingly prominent. In recent years, my country has paid attention to the adjustment of energy structure, given priority to the development of clean energy, and achieved significant results. Solar energy is inexhaustible and inexhaustible. It is the new energy source with the most development potential. The main force of the future energy system, solar cells are devices that can convert solar energy into electrical energy. The technology is mainly divided into three categories: the first category is single crystal / polycrystalline traditional diffusion technology, which has low efficiency and has been eliminated by the market; the second category It is PERC technology, which is an upgrade of the previous technology. After...

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Problems solved by technology

[0004] The drying process of the silicon wafer after cleaning is usually blown and dried with heated high-pressure air. At this time, the surface of the silicon wafer is in a hot and humid environment with sufficient oxygen. Oxidation, but high-efficiency batteries have high standards for the surface of the silicon wafer, the oxide layer on the surface of the silicon wafer should not be too thick, otherwise it will affect the subsequent process, especially the coating process, so in order to reduce the surface oxidation of the silicon wafer caused by the drying process, Often choose to reduce the drying temperature, reduce the wind speed, add nitrogen to assist purging and other methods to improve. Although these methods can achieve certain effects, they increase the drying time and affect the production capacity, and often due to many influencing factors It is difficult to find a stable process condition. Based on the above defects and deficiencies, it is necessary to improve the existing technology and design a silicon wafer drying device and its method.

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