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Silicon controlled rectifier device applied to electrostatic protection of deep submicron circuit

An electrostatic protection, deep sub-micron technology, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of low maintenance voltage, high turn-on voltage, etc., achieve low maintenance voltage, low turn-on voltage, and meet the requirements of electrostatic discharge protection Effect

Pending Publication Date: 2021-03-09
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the thyristor SCR is an ideal electrostatic protection device, but due to its own characteristics, the device still has imperfections such as high turn-on voltage and low maintenance voltage.

Method used

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  • Silicon controlled rectifier device applied to electrostatic protection of deep submicron circuit
  • Silicon controlled rectifier device applied to electrostatic protection of deep submicron circuit
  • Silicon controlled rectifier device applied to electrostatic protection of deep submicron circuit

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Embodiment Construction

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on The embodiments of the present invention and all other embodiments obtained by persons of ordinary skill in the art belong to the protection scope of the embodiments of the present invention.

[0031] This embodiment provides a thyristor device applied to electrostatic protection of deep submicron circuits, please refer to figure 1 , figure 1 It is a structural schematic diagram of the structure, specifically including:

[0032] Polysilicon 1, silicide barrier layer 2, silicon film layer 3, N-type well region 31, P-type well region 32, first N-type heavily doped region 33, first P-type heavily doped region 34, second N-type well region The heavil...

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Abstract

The invention relates to the technical field of silicon controlled rectifier electrostatic protection, and particularly relates to a silicon controlled rectifier device applied to electrostatic protection of a deep submicron circuit . In the structure, a first N-type heavily doped region and a first P-type heavily doped region are arranged at the upper part in an N-type well region side by side toform a first blank doped region; a second N-type heavily doped region and a second P-type heavily doped region are arranged at the upper part in the P-type well region side by side to form a second blank doped region; polycrystalline silicon and the first blank doped region have an overlapping region and cover the top of the second blank doped region; and a silicide barrier layer and the first P-type heavily doped region have an overlapping region, and the silicide barrier layer and the polycrystalline silicon have an overlapping region, and the silicide barrier layer also covers a polycrystalline silicon uncovered region in the top of the second blank doped region. According to the invention, the good current limiting capability of the silicide barrier layer is utilized, the capability of the SCR for discharging electrostatic current is improved, the SCR is enabled to have low maintaining voltage, and the electrostatic discharge protection requirement of the deep submicron circuit ismet.

Description

technical field [0001] The invention relates to the technical field of thyristor static protection, in particular to a thyristor device applied to static protection of deep submicron circuits. Background technique [0002] Static electricity exists all the time in nature. When the external environment of the chip or the static charge accumulated inside the chip flows into or out of the chip through the pins of the chip, the instantaneous current (peak value can reach several amperes) or voltage will damage the integrated circuit. disable the function of the chip. Effective ESD (Electron Static Discharge, electrostatic discharge) enables the protective device to quickly open and discharge ampere-level current in an electrostatic event, and at the same time, the voltage between the clamp port or the power supply / ground is below the breakdown voltage of the core circuit to achieve protection The core circuit is not damaged by static electricity, and when the circuit is working...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/74H01L29/06H01L27/02
CPCH01L29/74H01L29/0607H01L29/0684H01L27/0262H01L27/0296
Inventor 曾传滨李晓静闫薇薇高林春倪涛单梁王加鑫李多力赵发展罗家俊韩郑生
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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