High-dielectric polyimide film and preparation method thereof
A polyimide film, polyimide technology, applied in the direction of film/thick film capacitors, multilayer capacitors, fixed capacitor dielectrics, etc., can solve the problems of expensive and complex synthesis of new monomers, and achieve performance assurance and improvement. Interfacial compatibility, effect of reducing dielectric loss
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Embodiment 1
[0022] A high-dielectric polyimide film, the preparation method of which comprises the following steps:
[0023] S1, under nitrogen atmosphere, add 2mmol 2,5-diaminobenzenesulfonic acid, 8mmol 4,4'-diaminodiphenyl ether and 2mmol triethylamine to the solvent of 30ml of N,N-dimethylacetamide, After heating to 60 °C, stir until the dissolution is complete, then add 10 mmol of 3,3',4,4'-biphenyltetracarboxylic dianhydride and 30 ml of N,N-dimethylacetamide, continue to stir until all dissolved, and stir at room temperature to react After 4 hours, a polyamic acid solution was obtained; 10 ml of pyridine was added to the polyamic acid solution as an imidizing agent, 1 ml of acetic anhydride was added as a dehydrating agent after the dispersion was complete, and a polyimide solution was obtained after stirring and reacting for 6 hours;
[0024] S2. After mixing 0.1g flake graphite with 12mL concentrated sulfuric acid and 1.5mL concentrated phosphoric acid, slowly add 0.6g KMnO under...
Embodiment 2
[0028] A high-dielectric polyimide film, the preparation method of which comprises the following steps:
[0029] S1, under nitrogen atmosphere, add 2mmol2,5-diaminobenzenesulfonic acid, 8mmol3,4'-diaminodiphenyl ether and 2mmol triethylamine to the solvent of 30ml of N,N-dimethylacetamide, After heating to 60°C, stir until it dissolves completely, then add 10mmol of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride and 30ml of N,N-dimethylacetamide, continue to stir until all dissolved, and stir at room temperature After 4 hours of reaction, a polyamic acid solution was obtained; 10 ml of pyridine was added to the polyamic acid solution as an imidizing agent, 1 ml of acetic anhydride was added as a dehydrating agent after the dispersion was complete, and a polyimide solution was obtained after stirring and reacting for 6 hours ;
[0030] S2. After mixing 0.1g flake graphite with 12mL concentrated sulfuric acid and 1.5mL concentrated phosphoric acid, slowly add 0.6g KMnO un...
Embodiment 3
[0033] A high-dielectric polyimide film, the preparation method of which comprises the following steps:
[0034] S1, under nitrogen atmosphere, add 2mmol 2,5-diaminobenzenesulfonic acid, 8mmol4,4'-diaminodiphenyl sulfone and 2mmol triethylamine to the solvent of 30ml of N,N-dimethylacetamide, After heating to 60°C, stir until it dissolves completely, then add 10mmol of 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 30ml of N,N-dimethylacetamide, continue stirring until all dissolved, room temperature After stirring and reacting for 4 hours, a polyamic acid solution was obtained; 10 ml of pyridine was added to the polyamic acid solution as an imidizing agent, and 1 ml of acetic anhydride was added as a dehydrating agent after the dispersion was complete. After stirring for 6 hours, a polyimide was obtained. solution;
[0035] S2. After mixing 0.1g flake graphite with 12mL concentrated sulfuric acid and 1.5mL concentrated phosphoric acid, slowly add 0.6g KMnO under stir...
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