Flexible conductive film, preparation method thereof and flexible electronic device
A flexible electronic device, flexible conductive technology, applied in electrical components, cable/conductor manufacturing, conductive layers on insulating carriers, etc.
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[0037] One embodiment of the present invention provides a method for preparing the above-mentioned flexible conductive film, which includes: placing the first conductive film 21 on the raw material solution or prepolymer 11 of the base layer 10, and obtaining a microstructure with wrinkles (waves) by heat treatment. Shaped structure) flexible conductive film.
[0038] In one embodiment, the first conductive film 21 may be a conductive film with a flat surface, such as a planar conductive film.
[0039] The method for preparing a flexible conductive film according to an embodiment of the present invention can effectively reduce manufacturing costs, simplify manufacturing steps, and save working hours and manpower.
[0040] In one embodiment, the material of the base layer 10 is rubber, and the preparation method of the flexible conductive film includes:
[0041] The rubber precursor solution is arranged on the surface of the heat shrinkable sheet 30, and the (rubber) prepolyme...
Embodiment 1
[0070] Fabrication of Flexible Microstructured Conductive Films
[0071] The first conductive film 21 was prepared by immersing an 80 μm thick polypropylene non-woven fabric in a 2 mg / ml conductive graphene solution for 30 seconds and drying it in an oven at 60° C.
[0072] Scrape-coat the PDMS solution on the surface of the (PS) heat shrink sheet 30 with a thickness of 300 μm, the thickness of which is 300 μm, pre-cure in an oven at 50° C. for 30 minutes, and place the first conductive film 21 flat on the (PDMS) prepolymer 11 The first conductive film 21 is in a semi-embedded state, and then heat-treated in an oven at 180°C. The heat-shrinkable sheet 30 is heated and shrinks to cause wrinkles on the PDMS surface and is cured to obtain a flexible microstructured conductive film 110 . The actual photo of the flexible microstructured conductive film 110 is shown as image 3 As shown, the electron microscope appearance is as Figure 4A , 4B shown.
[0073] Fabrication of flex...
Embodiment 2
[0076] Fabrication of Flexible Microstructured Conductive Films
[0077] Put the 50μm thick PA66 electrospinning film into the 5mg / ml conductive graphene dispersion liquid, ultrasonically treat it, and after the graphene is coated on the fiber surface, place the PA66 electrospinning film in an oven at 60°C to dry , the first conductive film 21 is produced.
[0078] Scrape coat the ecoflex solution on the surface of the 300 μm thick (PS) heat shrink sheet 30 with a thickness of 300 μm, pre-cure in an oven at 60°C for 7 minutes and place the first conductive film 21 flat on the (ecoflex) prepolymer 11 The first conductive film 21 is in a semi-embedded state, and then heat-treated in an oven at 150°C. The heat shrinkable sheet 30 is heated and shrinks to cause wrinkles on the ecoflex surface while curing to obtain a flexible microstructured conductive film 210 .
[0079] Fabrication of Flexible Stretchable Electrodes, Flexible Strain Sensors, or Flexible Temperature Sensors
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Abstract
Description
Claims
Application Information
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