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Rapid preparation method of Cu3Sn foamy copper composite joint for interconnection of 3D packaged laminated chip

A technology of composite joints and copper foam, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as stress concentration and limited thickness of micro-solder joints, achieve good mechanical properties, and meet mass use Requirements, the effect of high conductivity

Pending Publication Date: 2021-03-12
HARBIN UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the invention is to solve the problem of full Cu 3 When Sn compound is used for three-dimensional stacked chip interconnection, it needs to be bonded at high temperature for a long time, and the thickness of micro solder joints is limited. All Cu 3 The use of Sn micro-solder joints will cause problems such as stress concentration. Design a Cu 3 A rapid preparation method of Sn / copper foam composite joint, which can quickly obtain Cu with good electrical and thermal conductivity and comprehensive mechanical properties at room temperature 3 Sn / foam copper composite connector

Method used

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  • Rapid preparation method of Cu3Sn foamy copper composite joint for interconnection of 3D packaged laminated chip
  • Rapid preparation method of Cu3Sn foamy copper composite joint for interconnection of 3D packaged laminated chip

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Embodiment Construction

[0010] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific examples, but the content of the present invention is not limited to the embodiments.

[0011] A kind of Cu for 3D packaging stacked chip interconnection 3 The rapid preparation method of Sn / foamed copper composite joint specifically comprises the following steps:

[0012] (1) Cleaning of foamed copper, tin alloy foil and copper substrate: commercial tin alloy (tin 99.3% copper 0.7%) foil (100μm), foamed copper (500ppi, 100μm) and copper substrate (1×1×0.5mm) Soak in acetone solution and ultrasonically clean for 5 minutes to remove oil stains on the surface of foamed copper, tin alloy foil and copper substrate; then soak the above foamed copper, tin alloy foil and copper substrate in 0.5% hydrochloric acid alcohol solution, ultrasonically cleaned for 5 minutes to remove surface oxides; then soak the above-mentioned foamed copper, tin alloy foil and...

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Abstract

According to the method, foamy copper is used as a framework, tin alloy is used as a filling material, heat is generated by utilizing ultrasonic vibration friction and an ultrasonic cavitation effectunder the action of external ultrasonic waves, and the micro welding spots formed by compounding Cu3Sn generated in situ and the residual foamy copper after reaction are rapidly obtained. The foamy copper can reduce the diffusion distance of copper atoms, so that the generation of Cu3Sn is accelerated, the thickness of the micro welding spot is not influenced by the diffusion speed of the copper atoms any more, the brittleness of pure Cu3Sn can be overcome by compounding the Cu3Sn and the foamy copper, and the electric conductivity, the heat conductivity and the comprehensive mechanical property of the micro welding spot are improved.

Description

technical field [0001] The invention relates to packaging and interconnection of semiconductor devices, in particular to a Cu used for interconnection of 3D packaging stacked chips 3 Rapid preparation method of Sn / copper foam composite joints. Background technique [0002] In recent years, with the rapid development of information, energy, aerospace and other industries, the requirements for miniaturization, integration and multi-function of microelectronic devices have been put forward. At present, the minimum feature size for integrated circuits has reached 7nm, which is close to the physical limit of Moore's law. In order to break through this limitation, three-dimensional packaging technology has become the focus of research, and the corresponding traditional micro-interconnection methods have been unable to meet the requirements of stacked chip interconnection. The interconnection of three-dimensional stacked chips requires that the interconnection solder joints can r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48
CPCH01L24/11H01L2224/111
Inventor 孙凤莲李文鹏
Owner HARBIN UNIV OF SCI & TECH
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