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Polyimide precursor composition, polyimide film, laminated film and display device

A technology of polyimide precursor and polyimide film, which is applied in the field of polyimide precursor composition, polyimide film, laminated film and display device, can solve peeling, contamination of the inner wall of curing device, Low adhesion and other problems, achieve the effect of reducing CTE value, reducing escape amount, and improving adhesion

Active Publication Date: 2021-05-25
武汉柔显科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the growth of people's demand for flexible display wearable and foldable display devices, polyimide film materials with various advantages have become the focus of people's attention, and the preparation of polyamic acid precursors is the key to the preparation of polyimide films. In the key link, various panel manufacturers have also vigorously strengthened the use of polyimide materials, but polyimide materials, as an organic polymer material, always face some aspects that are not suitable for the panel manufacturing process in application. For example, during the high-temperature baking process of polyimide (PI) curing, some volatiles tend to overflow, contaminate the inner wall of the curing device, and affect the film-forming properties of polyimide films.
For another example, in the process of the double-layer PI structure, the adhesion between PI and the a-Si of the intermediate isolation layer is low, which leads to the fact that the peeling between the second layer of PI and a-Si is prone to occur in some processes that require heating in the later stage. resulting in low yield of panel manufacturing

Method used

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  • Polyimide precursor composition, polyimide film, laminated film and display device
  • Polyimide precursor composition, polyimide film, laminated film and display device
  • Polyimide precursor composition, polyimide film, laminated film and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0105] A three-necked flask of 1L was equipped with a mechanical stirrer, a spherical condensing tube and a nitrogen guide head. In the reaction flask, 233.00gNMP and 10.2733g PDA were dropped into. After the PDA was completely dissolved, 14.1226g BPDA was added in the reaction flask, and the mixture was then React at 60°C for 6 hours. Subsequently, the reaction temperature was reduced to 25 degrees Celsius, and 0.9913gMDA was added successively to the reaction solution. After the MDA was completely dissolved, 14.1226g BPDA, 1.2889g BTDA and 0.3183g [1,1',2',1 ' '-Triphenyl]-3,3''-dicarboxylic acid, after the completion of the feeding, polymerize at 25 degrees Celsius for 24 hours to obtain a polyimide precursor composition with a solid content of 15wt.%.

Embodiment 2

[0107] The three-necked flask of 1L is equipped with mechanical stirring, spherical condenser and nitrogen guide head, drops into 187.02gNMP and 10.2733g PDA in the reaction flask, after the PDA dissolves completely, then adds 14.1226g BPDA in the reaction flask, then the mixture is in React at 60°C for 6 hours. Then the reaction temperature was lowered to 25 degrees Celsius, and 0.9913g MDA was added to the reaction solution in sequence. After the MDA was completely dissolved, 14.1226g BPDA, 1.2889g BTDA and 0.2542g 9H-fluorene-9,9-dicarboxylate were added to the reaction flask Acid, after the completion of the feeding, polymerize at 25 degrees Celsius for 24 hours to obtain a polyimide precursor composition with a solid content of 18wt.%.

Embodiment 3

[0109] The three-necked flask of 1L is equipped with mechanical stirring, spherical condenser and nitrogen guide head, drops into 232.66gNMP and 10.2733g PDA in the reaction flask, after the PDA dissolves completely, then adds 14.1226g BPDA in the reaction flask, then the mixture is React at 60°C for 6 hours. Subsequently, the reaction temperature was reduced to 25 degrees Celsius, and 0.9913gMDA was added successively in the reaction solution. After the MDA was completely dissolved, 14.1226g BPDA, 1.2889g BTDA and 0.2582g 4-phenoxyphthalic acid were added to the reaction flask, After the feeding was completed, the polymerization reaction was carried out at 25 degrees Celsius for 24 hours to obtain a polyimide precursor composition with a solid content of 15 wt.%.

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Abstract

The invention discloses a polyimide precursor composition, a polyimide film, a laminated film and a display device, which relate to the technical field of polymer materials. The polyimide precursor composition of the present invention comprises a polyimide precursor whose structure is a repeating unit represented by general formula (1) and component Z represented by general formula (2); general formula (1); general formula ( 1), X is a tetravalent tetracarboxylic acid residue, Y is a divalent diamine residue, R 1 and R 2 Independently selected from a hydrogen atom or a hydrocarbon group with a carbon number of 1-10; A-(COOR 3 ) n General formula (2); in general formula (2), A is an aromatic group, n is an integer ≥ 2; R 3 represents a hydrogen atom or an alkyl group. In the polyimide precursor composition containing component Z provided by the present invention, the escape of volatile matter during the curing process is significantly reduced.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polyimide precursor composition, a polyimide film, a laminated film and a display device. Background technique [0002] With the growth of people's demand for flexible display wearable and foldable display devices, polyimide film materials with various advantages have become the focus of people's attention, and the preparation of polyamic acid precursors is the key to the preparation of polyimide films. In the key link, various panel manufacturers have also vigorously strengthened the use of polyimide materials, but polyimide materials, as an organic polymer material, always face some aspects that are not suitable for the panel manufacturing process in application. For example, during the high-temperature baking process of polyimide (PI) curing, some volatiles tend to overflow, contaminate the inner wall of the curing device, and affect the film-forming properties of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18G09F9/30C08L79/08
CPCC08G73/1007C08G73/1042C08G73/1064C08G73/1067C08G73/1071C08G73/1085C08J5/18C08J2379/08G09F9/301
Inventor 肖桂林颜枫鲁丽平朱双全
Owner 武汉柔显科技股份有限公司
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