Method and device for cooling micro-channel semiconductor laser by high-speed gas carrying refrigerant

Abstract

The invention provides a method and a device for cooling a micro-channel semiconductor laser by high-speed gas carrying a refrigerant. According to the method, a liquid refrigerant is input into a micro-channel; particularly, high-speed airflow acts on the liquid refrigerant, so that gas-liquid high-speed mixing heat dissipation is performed on the semiconductor laser of the micro-channel packaging structure. Preferably, before the liquid refrigerant is input into the micro-channel, the high-speed gas flow is mixed with the liquid refrigerant, and then the liquid refrigerant is input into themicro-channel along with the high-speed gas flow. According to the invention, high-speed gas carries deionized water to carry out effective heat dissipation on the semiconductor laser device with themicro-channel packaging structure, and two advantages of high flow rate of the gas and high heat conductivity coefficient of deionized water are combined, so that the junction temperature of a laser chip can be obviously reduced, and higher peak output power of the semiconductor laser is realized.

Description

technical field [0001] The invention relates to a refrigeration method and device for a microchannel semiconductor laser. Background technique [0002] High-power semiconductor lasers (LDs) and their arrays are ideal laser sources in fields such as industry, medical treatment, and basic research, and are widely used. One of the biggest problems in the development of semiconductor lasers to high average power is heat dissipation. As the injection current increases, the thermal power consumption increases. The temperature rise of the active region caused by thermal power consumption will affect the performance parameters of the laser. In severe cases, the laser will be completely destroyed. How to effectively extract the heat transformed by the dissipated power and solve the problem of cooling and heat dissipation has become one of the key technologies that must be overcome in the development of high-power semiconductor lasers. At present, the electro-optical efficiency of hi...

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Problems solved by technology

[0003] The microchannel cooling heat sink quickly takes away the heat through the forced convection when the liquid flows through the microchannel, and has a strong heat dissipation capability. It is currently the main heat dissipation method for high-power semiconductor laser array chips, and there are many corresponding refrigeration systems / devices. However, it is mainly for various modification designs for the inner wall structure of the microchannel and the overall assembly structure, which may have higher requirements for the manufacturing process

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