Intersection hole processing method and circuit board
A processing method and technology of intersecting holes, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of dielectric layer material pulling, easy damage to the surface of the dielectric layer, affecting electroplating, graphics production, etc.
Pending Publication Date: 2021-03-19
深圳市鼎盛电路技术有限公司
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Problems solved by technology
During the processing, because the drill needle is in contact with the surface of the dielectric layer, it is easy to damage the surface of the dielectric layer, causing problems such as pulling and scratching of the dielectric layer material, which in turn causes defects such as burrs and burrs, affecting subsequent electroplating and graphics production , and even lead to product scrap
[0004] Therefore, the traditional method of machining intersecting holes has the problem of many defects
Method used
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[0037] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the application are given in the drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive.
[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application.
[0039] It can be understood that the terms "first", "second" and the like used in this application may be...
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Abstract
The invention relates to an intersection hole processing method and a circuit board, and the intersection hole processing method comprises the steps: carrying out the dry film pasting of the outer surface of a semi-finished circuit board, and forming a first dry film layer and a second dry film layer; performing solder mask processing on the outer surface of the semi-finished circuit board after dry film pasting processing to form a first solder mask layer and a second solder mask layer; performing windowing processing on the first solder mask layer and the second solder mask layer at the to-be-drilled position; and drilling holes in the windowing positions of the first solder mask layer and the second solder mask layer to form intersection holes. According to the intersection hole processing method, during drilling, the drill point firstly makes contact with the dry film layer and then reaches the dielectric layer, due to the protection and buffering effect of the dry film on the dielectric layer, friction of the drill point to the dielectric layer during drilling can be relieved, the dielectric layer is prevented from being pulled, damaged and generating burrs, and the defects ofintersection holes are reduced.
Description
technical field [0001] The present application relates to the technical field of printed circuit board processing, in particular to a method for processing intersecting holes and a circuit board. Background technique [0002] Printed circuit boards, also known as circuit boards, are widely used in various fields as supports for electronic components. In the case of some special welding or plugging needs, an intersecting hole will be designed on the circuit board, that is, two holes are in an intersecting state, and the appearance is in a "figure 8" shape. The intersecting hole can ensure the pins of components after soldering. and electrical stability. [0003] The traditional intersecting hole processing method directly drills the semi-finished circuit board to obtain the intersecting hole, and then performs desmearing, copper sinking and electroplating to obtain the intersecting hole on the plated board. During the processing, because the drill needle is in contact wit...
Claims
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Login to View More IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 刘克红鲁科何玉霞王培培刘克敢钟兰
Owner 深圳市鼎盛电路技术有限公司