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Diamine compound, polyimide precursor using same, and polyimide film

A polyimide precursor, polyimide film technology, applied in the direction of organic chemistry, coating, etc., can solve problems such as deterioration of mechanical properties

Pending Publication Date: 2021-03-19
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the introduction of these substituents causes a problem of deteriorating the mechanical properties which are the strength of polyimide

Method used

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  • Diamine compound, polyimide precursor using same, and polyimide film
  • Diamine compound, polyimide precursor using same, and polyimide film
  • Diamine compound, polyimide precursor using same, and polyimide film

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0210] preparation of the compound of formula 1-1

[0211]

[0212] The compound of formula A (35.0 g, 166.7 mmol) was dissolved in THF (270 mL) under a nitrogen atmosphere, and pyridine (pyr) (26.4 g, 333.4 mmol) was added, followed by cooling to 0°C. The compound of formula B (11.6 g, 83.4 mmol) was introduced into the solution in 4 portions at 10 minute intervals. After 3 hours, hexane (270 mL) was added to give a solid. The solid obtained after filtration was washed with hexane / ethyl acetate (10 / 7) to prepare the compound of formula C (23.8 g, yield 91.3%).

[0213] MS[M+H] + =314

[0214] The compound of formula C (20 g, 63.9 mmol) and the compound of formula D (10.2 g, 32.0 mmol) were dispersed in glacial acetic acid (200 mL) and heated to 100°C. After 4 hours, the temperature was lowered to room temperature, and then ethanol was added to obtain a solid. The solid obtained after filtration was washed with water and ethanol to prepare the compound of formula E (2...

preparation example 2

[0218] preparation of the compound of formula 1-2

[0219]

[0220] The compound of formula G was prepared in the same manner as the compound of formula C except that the compound of formula F was used instead of the compound of formula B in Preparation 1.

[0221] The compound of formula H is prepared in the same manner as the compound of formula E except that the compound of formula G is used instead of the compound of formula C. Finally, the compound of formula 1-2 was prepared in the same manner as the compound of formula 1-1, except that the compound of formula H was used instead of the compound of formula E.

[0222] MS[M+H] + =853

preparation example 3

[0223] preparation of the compound of formula 1-9

[0224]

[0225] The compound of formula J was prepared in the same manner as the compound of formula E except that the compound of formula I was used instead of the compound of formula D in Preparation 1.

[0226] The compound of formula 1-9 is prepared in the same manner as the method for preparing the compound of formula 1-1, except that the compound of formula J is used instead of the compound of formula E.

[0227] MS[M+H] + =731

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PUM

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Abstract

Disclosed is a novel diamine having a structure of comprising an intramolecular imide group, and further comprising aromatic cyclic groups linked by an ester group to both sides of the imide group. When the novel diamine is used as a polymerizable component for preparing a polyimide, a polyimide film having remarkably improved mechanical and thermal properties while maintaining optical propertiescan be provided.

Description

technical field [0001] This application claims the benefit of priority of Korean Patent Application No. 10-2018-0163793 filed on December 18, 2018 and Korean Patent Application No. 10-2019-0167742 filed on December 16, 2019, all of which The disclosure is incorporated herein by reference. [0002] The present invention relates to novel diamines and polyimide precursors and polyimide films by using the same. Background technique [0003] In recent years, weight reduction and miniaturization of products have been emphasized in the display field. Currently used glass substrates are heavy and brittle, and difficult to apply to continuous processes. Therefore, research is actively conducted to apply plastic substrates, which have advantages of being lightweight, flexible, and applicable to continuous processes, and which can replace glass substrates, to cell phones, notebook computers, and PDAs. [0004] In particular, polyimide (PI) resin has advantages of being easy to synth...

Claims

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Application Information

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IPC IPC(8): C07D209/48C07D401/14C07D403/14C08G73/10C08J5/18
CPCC07D209/48C07D401/14C07D403/14C08J5/18C08J2379/08C08G73/1007C08G73/1039C09D179/08C08G73/1046C08G73/1092C08G73/1064C08G73/1003
Inventor 丘冀哲金炅焕
Owner LG CHEM LTD
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