Miniature electric field sensor based on multi-structure coupling and preparation method of miniature electric field sensor
An electric field sensor, multi-structure technology, applied in electrostatic field measurement and other directions, can solve the problems of weak signal, low resolution, small size, etc., to achieve high stability, high sensitivity, and improve sensitivity and resolution.
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[0052] A kind of preparation method of miniature electric field sensor as above-mentioned, wherein, comprise the following steps:
[0053] Coating photoresist on the front side of the SOI wafer, patterning the photoresist through a mask;
[0054] Etching the top layer of silicon to define the structural shapes of the first resonator, the second resonator, the third resonator, the electrode unit and the fixed anchor point;
[0055] Remove the photoresist and cut;
[0056] Use HF solution or HF gas to remove the oxide layer below the first resonator, the second resonator, the third resonator, and the electrode unit, release the structure, and retain the oxide layer below the fixed anchor point to fix it on the substrate silicon;
[0057] Preferably, the oxide layer needs to be preserved during the cutting step, so that the fragile resonator structure will not be damaged during the cutting process.
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