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Miniature electric field sensor based on multi-structure coupling and preparation method of miniature electric field sensor

An electric field sensor, multi-structure technology, applied in electrostatic field measurement and other directions, can solve the problems of weak signal, low resolution, small size, etc., to achieve high stability, high sensitivity, and improve sensitivity and resolution.

Active Publication Date: 2021-03-23
INST OF ELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small size of the device, the micro-electric field sensor has problems such as relatively weak signals, and the resolution is low. At present, the electrostatic field resolution of the micro-electric field sensor is generally lower than 10V / m, which is difficult to meet the needs of these special fields.

Method used

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  • Miniature electric field sensor based on multi-structure coupling and preparation method of miniature electric field sensor
  • Miniature electric field sensor based on multi-structure coupling and preparation method of miniature electric field sensor
  • Miniature electric field sensor based on multi-structure coupling and preparation method of miniature electric field sensor

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preparation example Construction

[0052] A kind of preparation method of miniature electric field sensor as above-mentioned, wherein, comprise the following steps:

[0053] Coating photoresist on the front side of the SOI wafer, patterning the photoresist through a mask;

[0054] Etching the top layer of silicon to define the structural shapes of the first resonator, the second resonator, the third resonator, the electrode unit and the fixed anchor point;

[0055] Remove the photoresist and cut;

[0056] Use HF solution or HF gas to remove the oxide layer below the first resonator, the second resonator, the third resonator, and the electrode unit, release the structure, and retain the oxide layer below the fixed anchor point to fix it on the substrate silicon;

[0057] Preferably, the oxide layer needs to be preserved during the cutting step, so that the fragile resonator structure will not be damaged during the cutting process.

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Abstract

The invention discloses a miniature electric field sensor based on multi-structure coupling. The miniature electric field sensor comprises a first resonator, a second resonator, a third resonator, anelectrode unit and a fixing unit; the first resonator and the second resonator are connected through capacitive coupling or mechanical beam coupling; the third resonator and the second resonator are connected through capacitive coupling or mechanical beam coupling; the first resonator and the third resonator are arranged on the two sides of the second resonator respectively; the first resonator and the third resonator are connected with a reference zero potential or a certain reference potential; the electrode unit comprises an excitation electrode, a tuning electrode, a vibration detection electrode and an electric field induction electrode which are installed on the first resonator, the second resonator, the third resonator and the fixing unit respectively and is used for measuring the electric field intensity of the position where the miniature electric field sensor is located through the change of the field intensity between the pole plates of the electrodes . The electric field sensor has the advantages of high sensitivity, simple structure, adjustable dynamic range and sensitivity and the like.

Description

technical field [0001] The invention relates to the field of sensors in the electronic industry, in particular to a multi-structure coupling-based miniature electric field sensor and a preparation method thereof. Background technique [0002] Electric field sensors are widely used in many fields such as aerospace, meteorological detection, power system, industrial production, environmental monitoring, etc., and play an important role in safety assurance and scientific research. For different application fields, the properties of the electric field to be measured (such as the frequency, intensity, direction and duration of the electric field to be measured, etc.) and the working environment of the sensor (such as the temperature and state of the sensor's environment, etc.) are different. Therefore, the types of electric field sensors required for measurement are also different. At present, many electric field measurement principles and sensor processing technologies have bee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R29/12
CPCG01R29/12
Inventor 彭春荣修日任仁毋正伟夏善红
Owner INST OF ELECTRONICS CHINESE ACAD OF SCI
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