A functionalized boron nitride nanosheet/mxene/polybenzimidazole composite film with high thermal conductivity and preparation method

A composite film and benzimidazole technology, applied in the field of composite materials, can solve the problems of insufficient thermal conductivity and other problems, and achieve the effects of simple method, excellent thermal conductivity and wide application prospects
CN112552681BActive Publication Date: 2022-08-05SHANGHAI UNIVERSITY OF ELECTRIC POWER
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI UNIVERSITY OF ELECTRIC POWER
Publication Date
2022-08-05

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Abstract

The invention belongs to the technical field of composite materials, and provides a functionalized boron nitride nanosheet / MXene / polybenzimidazole high thermal conductivity composite film and a preparation method. Disperse in a dispersant, mix to obtain a mixed solution, then add polybenzimidazole to the mixed solution to obtain a functionalized boron nitride nanosheet / MXene / polybenzimidazole blend, and filter the blend to obtain a composite film . The invention utilizes the three-dimensional structure of the polybenzimidazole polymer to make the modified boron nitride and the MXene with electronegativity undergo electrostatic self-assembly to form the polybenzimidazole as the skeleton, the functionalized boron nitride nanosheets and the MXene as the Self-supporting films of mixed fillers. Boron nitride nanosheets and Ti 3 C 2 The filled network formed by the synergistic effect of Tx bridging effectively reduces the interfacial thermal resistance and endows the composite film with excellent thermal conductivity. The method is simple and effective, and the prepared high thermal conductivity film has wide application prospects in the fields of energy, electronics and the like.
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Description

technical field

[0001] The invention belongs to the technical field of composite materials, in particular to a functionalized boron nitride nanosheet / MXene / polybenzimidazole high thermal conductivity composite film and a preparation method. Background technique

[0002] With the rapid development of science and technology, electronic components and their equipment are gradually becoming integrated, miniaturized and light-weight. The concentration of large amounts of heat can have a detrimental effect on the safety and longevity of electronic components. Therefore, in order to ensure that the heat generated by the heat-generating electronic components is discharged in time and the electronic equipment can operate safely and stably for a long time, heat dissipation has become an urgent problem to be solved at present.

[0003] Boron nitride has become a widely used thermally conductive hybrid filler due to its ultra-high thermal conductivity, good insulation and mechanical pr...

Claims

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