Chip package, manufacturing method thereof and electronic device
A technology of chip packaging and electronic devices, which is applied in the manufacture of semiconductor/solid-state devices, circuits, electrical components, etc., can solve the problems of excellent electrical and heat dissipation characteristics, and the impossibility of chip packaging, and achieve excellent low resistance characteristics and heat dissipation effects. The effect of short electrical path and heat dissipation path and simple structure
Pending Publication Date: 2021-03-26
SKY CHIP INTERCONNECTION TECH CO LTD
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Problems solved by technology
[0004] The present application provides a chip package and its manufacturing method and electronic device to solve the problem that the chip package in the prior art cannot realize the technical effects of miniaturization, thinning and excellent electrical and heat dissipation characteristics
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[0037] In order to make the technical problems solved by the present application, the adopted technical solutions and the achieved technical effects clearer, the technical solutions of the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings.
[0038] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0039] see figure 1 , figure 1 It is a structural schematic diagram of the first embod...
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The invention discloses a chip package, a manufacturing method thereof and an electronic device, and the chip package comprises a patterned metal substrate plate which is provided with a groove, wherein the depth of the groove is smaller than the thickness of the metal substrate plate; a chip arranged in the groove; a first insulating layer which covers the chip and the metal base material plate,wherein a through hole is formed in the first insulating layer to expose part of the metal base material plate and the chip; and patterned first conductive layers arranged on the first insulating layer and in the through hole, so that the chip is connected to the metal substrate through the first conductive layer. By means of the mode, the chip package can achieve double-face heat dissipation of the chip, is simple in structure and short in electrical path and heat dissipation path, has the excellent low-resistance characteristic and heat dissipation effect, and miniaturization, lightness andthinness of the chip package can be achieved.
Description
technical field [0001] The present application relates to the technical field of chip packaging, and in particular to a chip package, a manufacturing method thereof, and an electronic device. Background technique [0002] In recent years, with the Mosfet (Metal Oxide Semiconductor Field Effect Transistor, Metal-Oxide Semiconductor Field Effect Transistor, referred to as Metal Oxide Semiconductor Field Effect Transistor), IGBT (Insulated Gate Bipolar Transistor, Insulated Gate Bipolar Transistor) power modules are almost used in Among all power industrial products, the corresponding power devices are also steadily developing towards the direction of high performance, fast speed, small size and multi-chip connection packaging. [0003] However, the traditional wire bonding (semiconductor bonding gold wire) and double-sided copper interconnection technology and manufacturing methods are gradually difficult to meet the requirements of high performance, fast speed, small size, mu...
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IPC IPC(8): H01L23/31H01L23/495H01L23/48H01L21/56
CPCH01L23/49568H01L23/49541H01L23/481H01L23/3121H01L21/561H01L2224/18H01L2224/32257H01L2224/24245H01L2224/73267H01L2224/32245H01L2924/18162
Inventor 霍佳仁宋关强江京刘建辉
Owner SKY CHIP INTERCONNECTION TECH CO LTD