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Semiconductor module with water-gas sealing function

A semiconductor and functional technology, which is applied in the field of semiconductor modules with water-vapor sealing function, can solve the problems of contact angle and solder joints being susceptible to moisture, semiconductor damage, and vibration, etc., and achieves ingenious structure, good air tightness, and reduced impact force. Effect

Active Publication Date: 2021-04-09
苏州普瑞赛光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the contact angle and soldering point of the semiconductor are easy to be affected by moisture, and it is easy to corrode for a long time, resulting in damage to the semiconductor, and the semiconductor is impacted or impacted, resulting in vibration and easy damage

Method used

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  • Semiconductor module with water-gas sealing function
  • Semiconductor module with water-gas sealing function
  • Semiconductor module with water-gas sealing function

Examples

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0025] refer to Figure 1-7 , a semiconductor module with a water-air sealing function, comprising a semiconductor 1, characterized in that a clamp hole 2 is installed on the surface of the semiconductor 1, the axial section length of the clamp hole 2 is the same as the axial section length of the semiconductor 1, and the clamp hole 2 The cross-sectional shape is circular, and a tin tube 6 is installed inside the outer sleeve 3 corresponding to the contact position between the first connector 4 and the second connector 5, and the outer sleeve 3 and the tin tube 6 are fixedly connected, which is convenient for users to clamp with tweezers. Pick.

[0026] The clip hol...

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Abstract

The invention relates to the technical field of semiconductors, and particularly relates to a semiconductor module with a water-gas sealing function. The semiconductor module comprises a semiconductor, a clamping hole is formed in the surface of the semiconductor, the clamping hole and the semiconductor are integrally designed, a first connecting piece is arranged on one side of the clamping hole, and a second connecting piece is arranged on one side of the first connecting piece. The first connecting piece is fixedly connected with the second connecting piece, an outer sleeve is installed on the surface of the first connecting piece, the first connecting piece is connected with the outer sleeve in a sleeving mode, a rotating piece is installed on the surface of the outer sleeve, the rotating piece is rotatably connected to the surface of the outer sleeve, and a first moving block is installed at the bottom of the rotating piece. A design is reasonable, the structure is ingenious, through mutual cooperation of the structures, damp corrosion is effectively prevented, connection is tighter, semiconductors are better protected, and the semiconductor module has good market competitiveness and is worthy of recommendation.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor module with a water-air sealing function. Background technique [0002] Semiconductors refer to materials whose conductivity is between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. , no matter from the perspective of technology or economic development, the importance of semiconductors is very huge. The core units of most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. , common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in the application of various semiconductor materials. [0003] How...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L23/00
CPCH01L23/48H01L23/564H01L23/562
Inventor 刘丙祥
Owner 苏州普瑞赛光电科技有限公司
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