Semiconductor laser packaging structure and packaging method thereof
A packaging structure and semiconductor technology, applied in the direction of semiconductor lasers, lasers, laser components, etc., can solve problems such as cavity surface damage, achieve improved performance, high resolution, large effective area and smooth side walls
Inactive Publication Date: 2021-04-09
勒威半导体技术(嘉兴)有限公司
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Problems solved by technology
[0009] However, a cleaning step is required before preparing the passivation film, which will cause certain damage to the cavity surface; the non-radiation absorption window technology will additionally prepare semiconductor materials
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[0082] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with specific embodiments.
[0083] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present specification shall have ordinary meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the embodiments of this specification do not indicate any sequence, quantity or importance, but are only used to distinguish different components. "Comprising" or "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but m...
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Abstract
The invention provides a semiconductor laser packaging structure and a packaging method thereof, and the semiconductor laser packaging structure comprises a semiconductor laser, a semiconductor refrigerator, and a metal layer disposed between the semiconductor laser and the semiconductor refrigerator, the semiconductor refrigerator comprises a silicon substrate, a metal electrode arranged on the silicon substrate, a semiconductor thermoelectric material deposited on the metal electrode, and a P-N structure etched on the semiconductor thermoelectric material. The semiconductor laser comprises a first electrode, a second electrode, and a substrate, a first limiting layer, a first waveguide layer, an active region, a second waveguide layer, a second limiting layer, an ohmic contact layer and a transmission grating layer having the ohmic contact layer in contact with the second limiting layer which are arranged between the first electrode and the second electrode and are sequentially arranged from the first electrode to the second electrode. The size of the packaged semiconductor laser is reduced, and the performance of the laser is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor optoelectronics, in particular to a packaging structure of a semiconductor laser and a packaging method thereof. Background technique [0002] With the development of laser technology, a new applied discipline - laser medicine has gradually formed. The unique advantages of laser have solved many problems that traditional medicine cannot solve in basic research and clinical application, and have attracted the attention of domestic and foreign medical circles. Semiconductor lasers (DL) are especially suitable for the manufacture of medical equipment due to their small size, light weight, long life, low power consumption, and wide wavelength coverage. In addition, semiconductor lasers are widely used in important fields such as optical fiber communication, optical disk access, spectral analysis and optical information processing. [0003] For traditional single-mode lasers, especially high-pow...
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IPC IPC(8): H01S5/0232H01S5/02345H01S5/024H01S5/026
CPCH01S5/02415H01S5/0268
Inventor 毛虎邱智贤毛森焦英豪
Owner 勒威半导体技术(嘉兴)有限公司