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Metal/resin composite structure, method for manufacturing metal/resin composite structure, and cooling device

A technology of resin compounding and manufacturing method, which is applied in metal layered products, chemical instruments and methods, synthetic resin layered products, etc., can solve the problems of reduced adhesion, no joint strength, and restrictions on popularization.

Pending Publication Date: 2021-04-09
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method of using an adhesive not only increases the number of production steps, but also sometimes reduces the adhesive force over time, or does not show joint strength at high temperatures, so it is difficult to apply to the requirements of automobiles, etc. In the field of heat resistance
In addition, mechanical joining methods such as screw fixing have been widely used until now, but their popularity has been limited in terms of weight reduction.

Method used

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  • Metal/resin composite structure, method for manufacturing metal/resin composite structure, and cooling device
  • Metal/resin composite structure, method for manufacturing metal/resin composite structure, and cooling device
  • Metal/resin composite structure, method for manufacturing metal/resin composite structure, and cooling device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0144] (Preparation method of resin composition (P))

[0145] The method for preparing the resin composition (P) is not particularly limited, and it can be prepared by a generally known method. For example, the following methods can be mentioned. First, thermoplastic resin (A), filler material (B) used as needed, and The resin composition (P) is obtained by mixing or melt-blending other compounding ingredients which are required to be used.

[0146]

[0147] The metal / resin composite structure 106 according to this embodiment can be manufactured, for example, by sequentially implementing the following steps 1, 2, and 3. Hereinafter, each process is demonstrated.

[0148] (Step 1) The step of preparing the metal member 103 having the fine unevenness 104 on the surface 110

[0149] (Step 2) A step of forming an inorganic particle layer 107 made of inorganic particles so as to cover part or all of the fine concave-convex shape 104 of the metal member 103 (hereinafter also r...

Embodiment 1

[0195] (surface roughening process)

[0196] An aluminum alloy plate (45 mm×18 mm×2 mm) of alloy number 5052 specified in JIS H4000 was degreased. Next, the obtained aluminum alloy plate was etched by immersing for 80 seconds in an aqueous solution (30° C.) in which 8.2% by mass of sulfuric acid, 7.8% by mass of ferric chloride, and 0.4% by mass of copper chloride were dissolved and shaken. . Next, ultrasonic cleaning was performed with running water (in water, 1 minute), and it was dried to obtain a surface-treated aluminum alloy plate.

[0197] The surface roughness of the obtained surface-treated aluminum alloy plate was measured on the surface according to JIS B0601:2001 (corresponding to ISO4287) using a surface roughness measuring device "SURFCOM 1400D (manufactured by TOKYO SEIMITSU CO., LTD.)". For the roughness, the average value of the ten-point average roughness (Rzjis) and the average value of the average length (RSm) of the roughness curve elements were obtained...

Embodiment 2

[0211] As the mold in the injection molding process, a mold capable of heating and cooling molding (Y-HeaT equipment manufactured by Yamashita Electric Co., Ltd.) was used, and the temperature of the mold was changed from 100°C to 120°C, and heating and cooling molding were performed. In the same manner as in Example 1, a metal / resin composite structure was produced, and the joint strength was evaluated. The bonding strength is 26MPa. The failure surface is a surface where interfacial failure and base metal failure coexist.

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Abstract

This metal / resin composite structure (106) comprises: a metal member (103); a resin member (105) that is bonded to the metal member (103) and is constituted of a resin composition including a thermoplastic resin; an inorganic particle layer (107) that is provided between the metal member (103) and the resin member (105) and that is constituted of inorganic particles. The metal member (103) has a fine uneven structure (104) at least on the surface of a bonding section for bonding with the resin member (105). The inorganic particle layer (107) is formed to cover all or part of the fine uneven structure (104) on the metal member (103). The metal member (103) and the resin member (105) are bonded via the inorganic particle layer (107).

Description

technical field [0001] The present invention relates to a metal / resin composite structure, a method for manufacturing the metal / resin composite structure, and a cooling device. Background technique [0002] In a wide range of industrial fields centered on the electric vehicle field, the usefulness of composite technology that integrates metals such as iron-based metals and aluminum-based metals with thermoplastic resins is increasing. [0003] Conventionally, adhesives are generally used for joining such metals and thermoplastic resins. However, the method of using an adhesive not only increases the number of production steps, but also sometimes reduces the adhesive force over time, or does not show joint strength at high temperatures, so it is difficult to apply to the requirements of automobiles, etc. In the field of heat resistance. In addition, conventionally, mechanical joining methods such as screw fixing have been widely used, but their popularity has been limited i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C26/00B29C45/14B32B15/20B32B27/28B32B15/08B32B15/09B32B27/36B32B27/34B32B15/088H01M10/613H01M10/6554
CPCH01M10/613H01M10/6554C23C26/00Y02E60/10B29C45/14311B29C2045/14868C23C24/04B32B27/30B32B15/08B32B2307/304B32B27/34B32B2307/702B32B27/28B32B15/06B32B2509/10B32B2307/302B32B2535/00B32B27/285B32B25/16B32B2307/734B32B15/082B32B27/32B32B2264/10B32B2270/00B32B15/18B32B25/14B32B27/22B32B27/365B32B2307/7246B32B2264/108B32B27/327B32B2262/101B32B27/304B32B27/322B32B15/085B32B27/20B32B3/08B32B27/308B32B27/306B32B2250/02B32B2262/106B32B2419/00B32B27/286B32B27/302B32B15/088B32B2255/06B32B27/281B32B2479/00B32B2457/00B32B2255/20B32B2605/00B32B15/20B32B2307/7265B32B3/30B32B2307/538B32B27/288B32B2264/102B32B15/09B32B2262/062H01M10/6551B29C45/14H01M10/6556B29C65/70B29C45/72B29C66/72321C09J1/00B32B15/16B32B27/00B32B7/04B32B9/00B29C45/1671B29C45/14008B29K2067/006B29K2071/12B29K2705/02B29K2709/00B29K2715/00B82Y30/00B82Y40/00C09K5/14B32B2264/1021
Inventor 木村和树富田嘉彦富永高广岛崎绚也
Owner MITSUI CHEM INC