Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device
A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition and can solve the problems of low solvent solubility and the like
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[0413]
[0414]The photosensitive resin composition of this invention can be prepared by mixing each said component. The mixing method is not particularly limited, and it can be performed by a conventionally known method.
[0415] Furthermore, for the purpose of removing foreign substances such as garbage and fine particles in the composition, it is preferable to perform filtration using a filter. The pore size of the filter is preferably 1 μm or less, more preferably 0.5 μm or less, even more preferably 0.1 μm or less. The material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon. As the filter, a filter pre-washed with an organic solvent can be used. In the filtering process of the filter, multiple types of filters can be used in parallel or in series. When using multiple types of filters, filters with different pore diameters or materials can be used in combination. Also, various materials can be filtered multiple times. When filtering multi...
Embodiment
[0473] Hereinafter, the present invention will be described in more detail with reference to examples. Materials, usage amounts, ratios, processing contents, processing steps, and the like shown in the following examples can be appropriately changed within a range not departing from the gist of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. Unless otherwise stated, "parts" and "%" are based on mass.
[0474]
[0475] [Polyimide precursor derived from pyromellitic dianhydride, 4,4'-diaminodiphenyl ether, and benzyl alcohol (A-1: Polyimide precursor without radical polymerizable group )Synthesis]
[0476]14.06 g (64.5 mmol) of pyromellitic dianhydride (dried at 140° C. for 12 hours) and 14.22 g (131.58 mmol) of benzyl alcohol were suspended in 50 mL of N-methylpyrrolidone while using molecular sieves. dry. The suspension was heated at 100°C for 3 hours. The reaction mixture was cooled to room tempe...
Embodiment 100
[0591] The photosensitive resin composition of Example 1 was passed through a filter with a pore width of 1.0 μm to perform pressure filtration, and then coated on the resin on which the copper thin layer was formed by spin forming (3500 rpm, 30 seconds). the surface of the substrate. After drying the photosensitive resin composition applied on the resin substrate at 100° C. for 2 minutes, it exposed with a stepper (manufactured by Nikon, NSR1505 i6). Expose through a mask, and at a wavelength of 365nm at 200mJ / cm 2 of exposure. After exposure, baking was performed, development was performed with cyclopentanone for 30 seconds, and rinse was performed with PGMEA for 20 seconds to obtain a pattern.
[0592] Next, it heated at 230 degreeC for 3 hours, and the interlayer insulating film for rewiring layers was formed. The interlayer insulating film for a rewiring layer is excellent in insulating properties.
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Abstract
Description
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