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Built-in cooling assembly type height sensor device for laser processing head

A technology of height sensor and laser processing head, which is applied in the direction of electromagnetic measuring devices, laser welding equipment, metal processing equipment, etc., can solve the problems of insufficient sensitivity of the heat removal method, increased product cost, and inability to guarantee the height sensor

Pending Publication Date: 2021-04-20
SUZHOU QUICK LASER TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, during the cutting or welding process of the laser cutting head or laser welding head, the internal temperature of the core component height sensor will continue to rise after being radiated by the heat of the plate, which will affect the normal operation of the internal electronic components, resulting in data such as the sensing capacitance value Abnormal changes, in severe cases, will cause the cutting head or welding head to suddenly lose control and stick to the plate or lift up suddenly during the working process
Due to the inability to maintain the distance value set by the system and the surface of the plate, the focus of the cutting head or welding head is abnormal, so that the cutting or welding work cannot be completed normally
In order to solve the problem that the height sensor cannot work normally due to the heat radiation of the plate during the cutting or welding process, the common solution is to surround the height sensor with a ring-shaped water-cooling module. The cooling water indirectly takes away the internal heat of the sensor; the patent No. 201910278449.7 in the prior art discloses a cooling laser cutting head, which directly installs a cooling block on the nozzle to cool the nozzle. The main existence of this solution is as follows Two disadvantages: 1) The way of indirect water cooling to take away heat is not sensitive enough, not direct enough, and the cooling effect is not ideal. It may be that the internal temperature of the height sensor has reached the normal working threshold, but the cooling system fails to take away the heat in time, resulting in sensor accuracy The situation of loss; 2) Due to the increase of parts and components, the weight of the equipment increases, which reduces the moving speed of the machine tool. At the same time, the increase of parts and components will also increase the cost of the product and weaken the competitiveness of the product; 3) The height sensor cannot be guaranteed to be free from the impact of cutting slag

Method used

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  • Built-in cooling assembly type height sensor device for laser processing head
  • Built-in cooling assembly type height sensor device for laser processing head
  • Built-in cooling assembly type height sensor device for laser processing head

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Embodiment

[0026] Please refer to Figure 1-Figure 6 , the present embodiment is a built-in cooling component type height sensor device 100 for a laser processing head, which includes a cooling main body 1, an upper cover plate 2 sealed and arranged on the cooling main body 1, and a casing wrapped around the outer circumference of the cooling main body 1 cylinder. 3. The ceramic body mounting seat 4 arranged at the bottom of the cooling body 1, the ceramic body locking sleeve 5 that locks the ceramic body nozzle assembly on the ceramic body mounting seat 4 as a whole, and the vertically penetrating laser channel 6, the cooling body 1 It includes a connection cover 11 that is covered with the upper cover 2, and a cooling cylinder 12 located below the connection cover 11. The upper surface of the connection cover 11 is concavely formed with a first receiving groove 13, and the inside of the first receiving groove 13 A sensor circuit board (not shown in the figure) is provided, and the oute...

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Abstract

The invention discloses a built-in cooling assembly type height sensor device for a laser processing head. The built-in cooling assembly type height sensor device comprises a cooling main body, an upper cover plate, a shell, a ceramic body mounting seat, a ceramic body locking sleeve and a vertically through laser channel, and is characterized in that the cooling main body comprises a connecting cover plate and a cooling cylinder body positioned below the connecting cover plate, the upper surface of the connecting cover plate is concave downwards to form a first storage groove, a sensor circuit board is arranged in the first storage groove, a plurality of layers of annular cooling flow channels are formed in the peripheral surface of the cooling cylinder body, a cooling flow guide hole which is communicated with the annular cooling flow channels and guides a cooling medium to the surface of a nozzle is formed in the ceramic body mounting seat and the ceramic body locking sleeve together, a vertically-through conduction body storage groove is formed in the cooling main body, and a conduction probe of which one end is communicated with the sensor circuit board and the other end is communicated with the nozzle is arranged in the conduction body accommodating groove. According to the built-in cooling assembly type height sensor device , the working temperature of the internal structure of the height sensor is always kept in a relatively stable range.

Description

【Technical field】 [0001] The invention belongs to the technical field of laser processing heads, in particular to a built-in cooling assembly type height sensor device for a laser processing head. 【Background technique】 [0002] At present, during the cutting or welding process of the laser cutting head or laser welding head, the internal temperature of the core component height sensor will continue to rise after being radiated by the heat of the plate, which will affect the normal operation of the internal electronic components, resulting in data such as the sensing capacitance value Abnormal changes, in severe cases, will cause the cutting head or welding head to suddenly lose control and stick to the plate or lift up suddenly during the working process. Due to the inability to maintain the distance value set by the system and the surface of the plate, the focus of the cutting head or welding head is abnormal, so that the cutting or welding work cannot be completed normall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/70G01B7/06
Inventor 赵勇波刘德军
Owner SUZHOU QUICK LASER TECH
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