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Millimeter wave monolithic integrated circuit packaging structure and method

A monolithic integrated circuit, packaging structure technology, applied in circuits, waveguides, electrical components, etc., can solve problems such as oscillation, increase parasitic inductance, and reduce circuit system stability, achieve reduced manual requirements, excellent electrical conductivity, adaptability strong effect

Pending Publication Date: 2021-04-23
北京国联万众半导体科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The increase of the arch height and span of the gold wire will also increase the parasitic inductance, which will reduce the stability of the circuit system and cause oscillation

Method used

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  • Millimeter wave monolithic integrated circuit packaging structure and method
  • Millimeter wave monolithic integrated circuit packaging structure and method
  • Millimeter wave monolithic integrated circuit packaging structure and method

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Embodiment Construction

[0024] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0026] like Figure 4-...

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Abstract

The invention discloses a millimeter wave monolithic integrated circuit packaging structure and method, and relates to the technical field of millimeter wave integrated circuits. The method comprises the following steps: manufacturing a millimeter wave monolithic integrated circuit; manufacturing an inverted transition probe; positively placing the millimeter wave monolithic integrated circuit in a cavity, and then enabling the metal layer of the inverted transition probe to be downward to make the probe bonding pad on the transition probe opposite to the microstrip bonding pad on the millimeter wave monolithic integrated circuit; and arranging indium balls between the probe bonding pad and the microstrip bonding pad, and spreading then the indium balls in a heating mode to weld the transition probe to the millimeter wave monolithic integrated circuit in an inverted buckling mode. The millimeter wave monolithic integrated circuit packaging structure prepared by the method is good in conductivity, the consistency and the high-performance characteristic of monolithic integrated circuit assembly can be greatly improved, and the requirements on assembly workers are greatly reduced.

Description

technical field [0001] The present invention relates to the technical field of millimeter-wave integrated circuits, in particular to a millimeter-wave monolithic integrated circuit packaging structure and a packaging method thereof. Background technique [0002] Millimeter wave refers to a section of electromagnetic wave with a frequency between 1mm and 10mm. Academically, it is generally considered to be 26.50GHz-300GHz. Millimeter waves have many applications, and have broad application prospects in radar, communication, security inspection, imaging, and test and measurement. In the high-end frequency of millimeter wave, such as the frequency band from 100GHz to 300GHz, due to higher frequency and shorter wavelength, it can greatly improve the imaging resolution when used in radar, and can greatly improve the communication bandwidth and speed when used in communication. It is in academia and industry. Focused technology areas. [0003] In order to give full play to the p...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L21/60H01L23/49H01P3/08
CPCH01L23/3107H01L24/85H01L24/48H01P3/08H01L2224/48135H01L2224/85009
Inventor 张志国刘育青安国雨张洋阳郭黛翡李雪荣
Owner 北京国联万众半导体科技有限公司
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