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A kind of hot-melt adhesive with rapid prototyping at low temperature and excellent boiling resistance and preparation method thereof

A hot-melt adhesive and formula technology, applied in the direction of adhesives, etc., can solve the problems of easy softening and shedding, poor boiling resistance, high sizing temperature, and achieve excellent boiling resistance, fast molding speed, and low melting temperature. Effect

Active Publication Date: 2022-03-25
ZHEJIANG HENGLI COMPOUND MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the current hot melt adhesive is a pure thermoplastic resin, in order to achieve its excellent bonding strength, its molecular weight needs to be prepared larger to achieve its stronger cohesion, which leads to a higher softening point and a higher sizing temperature. They are all at 160°C and above, and the cooling time after sizing is longer, usually more than 15 minutes to facilitate the complete cooling inside to achieve a relatively uniform effect, and it is easy to occur in the process of boiling water because it is a thermoplastic material. Soften and fall off, poor boiling resistance

Method used

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  • A kind of hot-melt adhesive with rapid prototyping at low temperature and excellent boiling resistance and preparation method thereof
  • A kind of hot-melt adhesive with rapid prototyping at low temperature and excellent boiling resistance and preparation method thereof
  • A kind of hot-melt adhesive with rapid prototyping at low temperature and excellent boiling resistance and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A method for preparing a hot melt adhesive, comprising the following raw materials in molar parts:

[0029]

[0030] Further, the preparation method comprises the following steps:

[0031] A. Add the formula amount of butynediol and triethanolamine into the reaction kettle, heat up to 110°C for full melting, then add the formula amount of phthalic anhydride, adipic acid and monobutyltin oxide, / h Gradually raise the temperature to 200°C, and keep warm for reaction;

[0032] B. When the acid value of the system mixture is reduced to 58mgKOH / g, lower the temperature to 120°C, add the prescribed amount of trimethylolpropane triglycidyl ether, and continue the heat preservation reaction;

[0033] C. When the acid value of the system mixture is less than 10mgKOH / g, and the epoxy equivalent is 875g / mol, cool down to 95°C, and then add m-phenylenediamine in the formulated amount to melt and mix for 1min;

[0034] D. After mixing evenly, the material is then discharged thr...

Embodiment 2

[0037] A method for preparing a hot melt adhesive, comprising the following raw materials in molar parts:

[0038]

[0039] Further, the preparation method comprises the following steps:

[0040] A. Add the formula amount of butynediol and triethanolamine into the reaction kettle, heat up to 120°C for full melting, then add the formula amount of phthalic anhydride, adipic acid and monobutyltin oxide, / h Gradually raise the temperature to 210°C, and keep warm for reaction;

[0041] B. When the acid value of the system mixture is reduced to 51mgKOH / g, lower the temperature to 130°C, add the formulated amount of trimethylolpropane triglycidyl ether, and continue the heat preservation reaction;

[0042] C. When the acid value of the system mixture is less than 10mgKOH / g, and the epoxy equivalent is 812g / mol, the temperature is lowered to 100°C, and then the m-phenylenediamine of the formulated amount is added to melt and mix for 0.5min;

[0043] D. After mixing evenly, the ma...

Embodiment 3

[0046] A method for preparing a hot melt adhesive, comprising the following raw materials in molar parts:

[0047]

[0048] Further, the preparation method comprises the following steps:

[0049] A. Add the formula amount of butynediol and triethanolamine into the reaction kettle, heat up to 110°C for full melting, then add the formula amount of phthalic anhydride, adipic acid and monobutyltin oxide, / h Gradually raise the temperature to 205°C, and keep warm for reaction;

[0050] B. When the acid value of the system mixture is reduced to 56mgKOH / g, lower the temperature to 125°C, add the prescribed amount of trimethylolpropane triglycidyl ether, and continue the heat preservation reaction;

[0051] C. When the acid value of the system mixture is less than 10mgKOH / g, and the epoxy equivalent is 960g / mol, cool down to 98°C, and then add m-phenylenediamine in the formulated amount to melt and mix for 1min;

[0052] D. After mixing evenly, the material is then discharged thr...

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Abstract

A hot-melt adhesive and a preparation method thereof, comprising the following raw materials in molar parts: 8-12 parts of phthalic anhydride; 5-10 parts of adipic acid; 7-13 parts of butynediol; 3 parts of triethanolamine ‑6 parts; 5‑9 parts of trimethylolpropane triglycidyl ether; 1‑2 parts of m-phenylenediamine; 0.02‑0.05 parts of monobutyltin oxide. The hot melt adhesive has a low melting temperature, fast curing and molding speed at low temperature, excellent stickiness after curing, excellent durability and boiling resistance, and can be used for low-temperature materials such as cartons, wood, floors, plastic-wood composite boards and other materials. Knot.

Description

technical field [0001] The invention relates to the field of hot-melt adhesives, in particular to a hot-melt adhesive for rapid prototyping at low temperature and excellent boiling resistance and a preparation method thereof. Background technique [0002] Hot melt adhesive can change its physical state with the change of temperature within a certain temperature range, and the product itself is solid, which is convenient for packaging, transportation and storage. It is solvent-free, pollution-free, non-toxic, simple production process, high added value, It is popular for its advantages of high bonding strength and fast speed. [0003] Since the current hot melt adhesive is a pure thermoplastic resin, in order to achieve its excellent bonding strength, its molecular weight needs to be prepared larger to achieve its stronger cohesion, which leads to a higher softening point and a higher sizing temperature. They are all at 160°C and above, and the cooling time after sizing is l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J167/06C08G63/685C08G63/85
CPCC09J167/06C08G63/6858C08G63/85
Inventor 王永垒李海云邢楠楠柴雅倩张雅文
Owner ZHEJIANG HENGLI COMPOUND MATERIAL CO LTD
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