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a cooling element

A technology of heat dissipation components and components, which is applied in the direction of electrical components, heat exchange materials, and structural parts of electrical equipment. It can solve the problems of cumbersome dispersion of nanoparticles and poor economic benefits, and achieve low cost and high heat transfer coefficient. , good dispersion effect

Active Publication Date: 2022-04-29
AAC TECH NANJING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the current methods for improving the dispersion of nanoparticles are relatively cumbersome and have poor economic benefits.

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] Preparation of nanofluid working medium:

[0070] (1) Mixing step: adding a certain amount of aluminum sulfate solid into deionized water to form an aluminum sulfate solution with a weight content of 0.5 wt %;

[0071] (2) Hydrolysis step: the aluminum sulfate solution prepared in the mixing step is placed in an oven at 180° C. for 1 hour to be hydrolyzed to obtain the prepared aluminum sulfate nanofluid.

[0072] Preparation of the heat dissipation element 100: using the aluminum sulfate nanofluid obtained above as a cooling working medium, after sintering the absorbent core 2 on the element body 1 under a nitrogen atmosphere, injecting the above obtained aluminum sulfate nanofluid into the closed inner cavity 10 In the process, the heat dissipation element 100 is finally produced through steps such as vacuuming and capping.

Embodiment 2

[0074] Preparation of nanofluid working medium:

[0075] (1) Mixing step: adding a certain amount of aluminum sulfate solid into deionized water to form an aluminum sulfate solution with a weight content of 0.8wt%;

[0076] (2) Hydrolysis step: the aluminum sulfate solution prepared in the mixing step was placed in an oven at 190° C. for 1.5 h to be hydrolyzed to obtain the prepared aluminum sulfate nanofluid.

[0077] Preparation of the heat dissipation element 100: using the aluminum sulfate nanofluid obtained above as a cooling working medium, after sintering the absorbent core 2 on the element body 1 under a nitrogen atmosphere, injecting the above obtained aluminum sulfate nanofluid into the closed inner cavity 10 In the process, the heat dissipation element 100 is finally produced through steps such as vacuuming and capping.

Embodiment 3

[0079] Preparation of nanofluid working medium:

[0080] (1) Mixing step: adding a certain amount of aluminum sulfate solid into deionized water to form an aluminum sulfate solution with a weight content of 2wt%;

[0081] (2) Hydrolysis step: the aluminum sulfate solution prepared in the mixing step was placed in an oven at 200° C. for 2 hours to be hydrolyzed to obtain the prepared aluminum sulfate nanofluid.

[0082] Preparation of the heat dissipation element 100: using the aluminum sulfate nanofluid obtained above as a cooling working medium, after sintering the absorbent core 2 on the element body 1 under a nitrogen atmosphere, injecting the above obtained aluminum sulfate nanofluid into the closed inner cavity 10 In the process, the heat dissipation element 100 is finally produced through steps such as vacuuming and capping.

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Abstract

The invention provides a heat dissipation element, comprising an element body formed with a closed inner cavity, an absorbent core located in the closed inner cavity, and a cooling working medium filled in the closed inner cavity, and the cooling working medium is nanofluid A working medium, the nanofluid working medium is a solution obtained by hydrolyzing an aqueous solution of an acidic salt ion compound. The nanofluid working medium used in the heat dissipation element provided by the invention has good dispersibility and good heat transfer effect, and the preparation method of the nanofluid working medium is simple and fast, and the manufacturing cost is low.

Description

【Technical field】 [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation element. 【Background technique】 [0002] With the popularization and promotion of 5G technology, the high-frequency and high-speed development trend of mobile phone electronic components and integrated circuits is becoming more and more obvious, which leads to an increase in the heat flux generated by the processor during operation, a sharp increase in heat generation, and the electronic equipment is working. Reliability is extremely sensitive to temperature, and high heat flow will pose a great threat to the reliability of electronic components. In order to solve this problem, rapid heat dissipation technology for electronic components has received extensive attention. At present, the heat dissipation technology of mobile phone electronic products is usually to place heat pipes or vapor chambers at heat sources such as mobile phone processors and ba...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20C09K5/04
CPCH05K7/2029H05K7/20309H05K7/20318C09K5/048
Inventor 吴高高王和志黄国创
Owner AAC TECH NANJING