A silicon carbide powder feeding method, device and application
A silicon carbide powder and feeding device technology, which is applied in chemical instruments and methods, polycrystalline material growth, single crystal growth, etc., can solve the problems of poor quality and yield of silicon carbide crystals, and achieve the reduction of nitrogen content and growth quality High, isolation adsorption effect
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Embodiment 1
[0057] refer to Figure 1-2 , this embodiment provides a silicon carbide powder feeding device, the device includes a feeding chamber 1, an air inlet is opened on the feeding chamber 1, and a protective gas pipeline is connected to the air inlet; The feeding channel 2, the feeding channel 2 runs through the top of the feeding cavity 1 and extends to the inside of the feeding cavity 1. The protective gas is introduced into the feeding chamber 1 through the air inlet, so that the feeding process is carried out under the atmosphere of the protective gas, which effectively reduces the entry of nitrogen into the silicon carbide powder, and can isolate the adsorption of nitrogen in the crucible or silicon carbide raw materials. The nitrogen gas in the crucible or the silicon carbide raw material is effectively reduced, and the quality of the crystal is improved.
[0058] Specifically, the shape and size of the feed channel 2 are not specifically limited, as long as the silicon carb...
Embodiment 2
[0068] This embodiment provides a method for feeding using the device described in Embodiment 1, the method comprising the following steps:
[0069] (1) Vacuumize the feeding device so that the vacuum degree in the feeding device is less than 10 -3 mbar; Specifically, start the mechanical pump to suck away the air in the feeding device (including the preparation area, work area and assembly area), and stop the mechanical pump; then the protective gas enters the feeding device through the protective gas pipeline, and the protective gas is selected from hydrogen, At least one of helium, neon and argon; preferably, the protective gas is selected from argon or helium; the protective gas is not less than 99.999%, so that the protective gas circulates in the feeding device, the The flow rate of protective gas circulation is 30-400mL / min;
[0070] Control the pressure in the feeding device to be 1.0×10 2 Pa~1.1×10 5 Pa; preferably, the pressure in the control feeding device is 1.0...
Embodiment 3
[0080] A method for growing a silicon carbide crystal, specifically comprising the following steps:
[0081] (1) Filling stage: use the methods of Examples 1 to 6 and Comparative Examples 1 to 5 to fill the crucible, respectively, to obtain filled crucibles 1#-6# and filled crucibles 1#-5#;
[0082] (2) Assembling stage: place the filled crucibles 1#-6# and the filled crucibles 1#-5# in the furnace body of the crystal growth furnace respectively;
[0083] (3) Impurity removal stage: use heating device to heat, control the temperature in the furnace body to 700-1100°C, pass inert gas for cleaning, the flow rate of inert gas is 50-500ml / min, and control the pressure in the furnace body to 2kPa-8kPa , hold time 10 ~ 40min;
[0084] (4) Crystal growth stage: control the pressure of the furnace body to 10kPa-50kPa, the temperature to 2000-2400°C, and the time to 50-200h; specifically, control the furnace body pressure to 20kPa, the temperature to 2200°C, and the time to 80h;
[008...
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