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Semiconductor wafer cleaning device and method based on ultrasonic vibration processing

A cleaning device and vibrating technology, applied in the direction of liquid cleaning methods, cleaning methods and utensils, chemical instruments and methods, etc., can solve problems such as circuit function damage, integrated circuit failure, etc.

Active Publication Date: 2021-06-04
JIANGSU ASIA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the manufacturing process of semiconductor wafers, it is necessary to avoid dust particles and metal pollution, otherwise it will cause damage to the circuit function in the chip and lead to the failure of the integrated circuit. Therefore, on the premise of not destroying the surface characteristics and electrical characteristics of the wafer, a A cleaning device capable of effectively removing impurities such as fine dust remaining on a wafer and a cleaning method thereof

Method used

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  • Semiconductor wafer cleaning device and method based on ultrasonic vibration processing
  • Semiconductor wafer cleaning device and method based on ultrasonic vibration processing
  • Semiconductor wafer cleaning device and method based on ultrasonic vibration processing

Examples

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Embodiment 1

[0065] see Figure 1-Figure 10 As shown, one of the purposes of this embodiment is to provide a cleaning device for semiconductor wafers based on ultrasonic vibration processing, including a cleaning machine 100 for cleaning wafers, and the cleaning machine 100 at least includes:

[0066] The cleaning body 110, the cleaning body 110 includes a cleaning box 130, the cleaning box 130 is provided with a cleaning tank 131, the cleaning tank 131 is a cube structure groove, the surface of the cleaning box 130 is provided with a water inlet pipe 133, and the water inlet pipe 133 is connected to the cleaning tank 131 The bottom of the cleaning tank 131 is provided with an outlet pipe 134, the outlet pipe 134 is provided with a valve 135, the cleaning tank 131 is provided with a vibrating body 200, the top of the cleaning box 130 is connected with a shielding body 140, and the shielding body 140 includes a cleaning box 130. Connected top board 141, top board 141 is provided with handra...

Embodiment 2

[0088] see Figure 11 The schematic block diagram of the ultrasonic sounder is shown, which is composed of power grid filter, power frequency rectification and filtering, high-frequency inverter, high-frequency transformer, ultrasonic transducer and PWM circuit. A device that converts high-frequency alternating current corresponding to the transducer to drive the transducer to work. An ultrasonic transducer is a device that converts electromagnetic energy into mechanical energy (sound energy), usually made of piezoelectric ceramics or other magnetostrictive Made of high-frequency materials, ultrasonic waves convert high-frequency electrical energy into mechanical vibrations through transducers;

[0089] The principle of the ultrasonic cleaning machine is mainly to convert the sound energy of the power ultrasonic frequency source into mechanical vibration through the transducer, and radiate the ultrasonic wave to the cleaning liquid in the tank through the wall of the cleaning ...

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Abstract

The invention relates to the technical field of semiconductor equipment, in particular to a cleaning device and method for semiconductor wafers based on ultrasonic vibration processing. It includes a washing machine, and the washing machine at least includes: a cleaning body, the cleaning body includes a cleaning tank, the cleaning tank is provided with a cleaning tank, the cleaning tank is provided with a water inlet pipe, the cleaning tank is provided with a water outlet pipe, the water outlet pipe is provided with a valve, and the cleaning tank is provided with a The vibrating body, the cleaning box is connected with a shielding body, the shielding body includes a top plate, and the top plate is provided with handrails; the installation body, the installation body includes a No. 4 connector, and the No. 4 connector is provided with a No. , the installation groove is installed with a fixed body, the fixed body includes a fixed frame, the fixed frame is provided with a distance adjustment body, the distance adjustment body includes an adjustment rod, and the adjustment rod is connected with a contact plate. The present invention mainly proposes a cleaning device and a cleaning method that can effectively remove impurities such as fine dust remaining on a wafer.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a cleaning device and method for semiconductor wafers based on ultrasonic vibration processing. Background technique [0002] Semiconductor wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon and silicon rods. After grinding, polishing, and slicing, silicon wafers are formed, that is, wafers. [0003] In the manufacturing process of semiconductor wafers, it is necessary to avoid dust particles and metal pollution, otherwise it will cause damage to the circuit function in the chip and lead to the failure of the integrated circuit. Therefore, on the premise of not destroying the surface characteristics and electrical characteristics of the wafer, a Disclosed are a cle...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/687B08B3/02B08B13/00
CPCB08B3/02B08B13/00H01L21/67051H01L21/68721H01L21/68735
Inventor 钱诚李刚童建
Owner JIANGSU ASIA ELECTRONICS TECH CO LTD
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