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Space synthesis power amplifier and heat dissipation device thereof

A technology of power amplifier and space synthesis, which is applied in improving amplifiers to reduce temperature/power supply voltage changes, modification through conduction heat transfer, cooling/ventilation/heating transformation, etc. It can solve the problem of reducing the thermal resistance of space synthesis structure and heat dissipation environment , reduce system weight, limited heat dissipation performance, etc., to achieve the effect of reducing the risk of overheating and burning, efficient heat transfer performance, and light weight

Pending Publication Date: 2021-04-30
合肥应为电子科技有限公司
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AI Technical Summary

Problems solved by technology

[0006] In view of the limited heat dissipation performance of the equipment in the prior art and the problem of heavy structure, the present invention designs a set of space power amplifier vapor chamber heat dissipation structure to reduce the conduction thermal resistance between the space synthesis structure and the heat dissipation environment, reduce the weight of the system, and at the same time No need for overly complex auxiliary heat dissipation structure equipment, which is conducive to expanding its application range

Method used

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  • Space synthesis power amplifier and heat dissipation device thereof
  • Space synthesis power amplifier and heat dissipation device thereof
  • Space synthesis power amplifier and heat dissipation device thereof

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Embodiment 1

[0045] Such as Figure 5 to Figure 6 As shown, a space synthesis power amplifier has the following characteristics:

[0046] The spatially combining power amplifier comprises a body structure 4 with an internal cavity 41 . The main structure 4 is composed of power amplifier units in the form of circumferential distribution in space, see Figure 5 . The two ends of the main body structure 4 are small-diameter input ports 42 and output ports 43 of conical structure respectively. The main structure 4 can be functionally divided into a power section, a synthesis section, and a power amplifier section between the power section and the synthesis section, wherein the power amplifier section is provided with a chip mounting structure 5 located in the inner cavity 41 for use in For coupling and amplifying power signals, the chip mounting structure 5 is circular, and the small-diameter channel formed at its inner diameter is coaxial with the main structure 4 . The power amplifier ch...

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Abstract

The invention relates to a space synthesis power amplifier and a heat dissipation device thereof, and belongs to the technical field of heat dissipation equipment. The heat dissipation device comprises a vacuum chamber; the vacuum chamber comprises a first panel and a second panel which are connected with each other; the first panel is a heat absorption part; the second panel is a heat dissipation part; the first panel and the second panel are both of a hollow structure, and the hollow structure of the first panel is communicated with the hollow structure of the second panel to form a complete cavity together; a liquid working medium is arranged in the cavity; and a capillary structure is attached to the side wall of the cavity between the first panel and the second panel, and the capillary structure penetrates through the whole cavity in the arrangement direction of the first panel and the second panel. The heat dissipation system adopted by the invention can effectively improve the axial heat conduction performance of the internal unit synthesis structure, reduce the heat concentration of a heating area, and reduce the risks of performance reduction and overheat burnout caused by high temperature.

Description

technical field [0001] The invention relates to the technical field of heat dissipation equipment, in particular to a space synthesis power amplifier and a heat dissipation device thereof. Background technique [0002] As high-power microwave devices are widely used in radar technology and wireless communication technology, the requirements for output power and power-added efficiency of microwave solid-state high-power amplifiers are also becoming higher and higher. [0003] Space synthesis technology is a three-dimensional solution that upgrades the traditional planar circuit-based design technology to design using three-dimensional electromagnetic fields. Compared with planar synthesis technology, it has the advantages of small size, high synthesis efficiency, and high output power. But on the other hand, due to the relatively compact space structure, after the chip units form a spatially distributed structure, each chip unit is not directly connected to the heat sink of ...

Claims

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Application Information

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IPC IPC(8): H05K7/20H03F1/30
CPCH05K7/2039H05K7/20218H03F1/30Y02D30/70
Inventor 张衡章放汪佳娣刘贵亚
Owner 合肥应为电子科技有限公司
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