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Composite low-temperature lead-free solder paste and preparation method thereof

A lead-free solder paste, composite technology, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems of push-pull reliability test requirements, high melting point temperature, low bonding strength between solder and solder joints, etc.

Pending Publication Date: 2021-05-04
深圳市朝日电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the most commonly used solder paste base material in the market is Sn96.5-3.0Ag-Cu0.5 lead-free solder alloy, but Sn96.5-3.0Ag-Cu0.5 lead-free solder alloy generally has a high melting point temperature, and the solder and The bonding strength of solder joints is low and cannot pass the special push-pull reliability test requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The first step is to prepare raw materials according to the stated weight percent: 90 parts of Sn-3.0Ag-Cu0.5 alloy powder, 9 parts of solder paste: 0.5 part of metal Mg powder; 0.5 part of metal In powder, wherein the solder paste The component content is: 72 parts by weight of polymerized rosin resin, 0.5 parts by weight of antioxidant 4-dimethyl-6-tert-butylphenol, 18 parts by weight of solvent triethylene glycol butyl ether, and 5 parts by weight of polyamide wax as a thixotropic agent , 4.5 parts by weight of activator glutaric acid;

[0023] In the second step, add the rosin resin and the solvent described in step 1) in the high-pressure heating reaction vessel successively, heat to 190 ° C, and stir to fully dissolve the rosin resin;

[0024] In the third step, the temperature of the mixture obtained in the above step 2) is lowered to 120° C., and then the antioxidant, activator, and thixotropic agent described in 1) are added in sequence, and kept stirring at 12...

Embodiment 2

[0029] The first step is to prepare raw materials according to the stated weight percentage: 88 parts of Sn-3.0Ag-Cu0.5 alloy powder, 10.5 parts of solder paste: 0.5 part of metal Mg powder; 1 part of metal In powder, of which The component content is: 72 parts by weight of polymerized rosin resin, 0.5 parts by weight of antioxidant 4-dimethyl-6-tert-butylphenol, 18 parts by weight of solvent triethylene glycol butyl ether, and 5 parts by weight of polyamide wax as a thixotropic agent , 4.5 parts by weight of activator glutaric acid;

[0030] In the second step, add the rosin resin and the solvent described in step 1) in the high-pressure heating reaction vessel successively, heat to 190 ° C, and stir to fully dissolve the rosin resin;

[0031] In the third step, the temperature of the mixture obtained in the above step 2) is lowered to 120° C., and then the antioxidant, activator, and thixotropic agent described in 1) are added in sequence, and kept stirring at 120° C. for 70...

Embodiment 3

[0036] The first step is to prepare raw materials according to the stated weight percent: 88 parts of Sn-3.0Ag-Cu0.5 alloy powder, 10.5 parts of solder paste: 1 part of metal Mg powder; 0.5 part of metal In powder, of which The component content is: polymerized rosin resin 72 parts by weight, antioxidant 4-dimethyl-6-tert-butylphenol 0.5 parts by weight, solvent triethylene glycol butyl ether 18 parts by weight, thixotropic agent polyamide wax 5 parts by weight , 4.5 parts by weight of activator glutaric acid;

[0037] In the second step, in the high-pressure heating reaction vessel, add the rosin resin and the solvent described in step 1) in sequence, heat to 190 ° C, and stir to fully dissolve the rosin resin;

[0038] In the third step, the temperature of the mixture obtained in the above step 2) is lowered to 120° C., and then the antioxidant, activator, and thixotropic agent described in 1) are added in sequence, and kept stirring at 120° C. for 70 minutes;

[0039] The ...

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Abstract

The invention discloses a composite low-temperature lead-free solder paste and a preparation method thereof. The composite low-temperature lead-free solder paste comprises tin-based solder alloy powder, metal Mg powder, metal In powder and flux paste, and is characterized in that the solder paste comprises the following components by weight: 85%-90% of tin-based solder alloy powder, 0.5%-1% of metal Mg powder,1%-2% of metal In powder and 8%-12% of paste flux. According to the selected materials, the component proportion and the production process, the solder paste has good conductivity and mechanical properties. The metal element Mg and the metal element In have the characteristics of high specific strength and specific stiffness, strong shock resistance, capability of bearing larger impact load, good thermal fatigue performance, high electrical conductivity, high thermal conductivity and the like, and are added to the solder paste so that the welding strength, the electrical conductivity and the thermal conductivity of the composite low-temperature lead-free solder paste are remarkably improved, and the solder paste can completely pass an SMT push-pull force test; and the thixotropy is excellent, and the requirements of different printing processes can be met.

Description

technical field [0001] The invention relates to a solder paste and a preparation method thereof, in particular to a composite low-temperature lead-free solder paste and a preparation method thereof. Background technique [0002] Solder paste is a new type of soldering material that emerged with Surface Mount Technology (SMT). It is a paste mixed with tin-based alloy solder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the soldered components and printed circuit pads are welded together to form Permanent connection. At present, the most commonly used solder paste base material in the market is Sn96.5-3.0Ag-Cu0.5 lead-free solder alloy, but Sn96.5-3.0Ag-Cu0.5 lead-free solder alloy generally has a high melting point temperature, and the solder and The bonding strength of sold...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/363
CPCB23K35/262B23K35/362B23K35/3613B23K35/025
Inventor 罗坤王素波
Owner 深圳市朝日电子材料有限公司
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