Laser etching equipment for chip silicon wafer and chip production process

Abstract

The invention relates to the technical field of laser etching and discloses laser etching equipment for a chip silicon wafer and a chip production process. The equipment comprises a worktable, a double-layer mounting rack, a laser gun and a mechanical arm, wherein an adjustable hoisting rack is arranged at the bottom end of the laser gun and comprises a top hoisting rack, an etching template mounting rack and a movable lens rack. By arranging a primary lens capable of being disassembled and replaced, a laser beam emitted by the laser gun is subjected to a filtering action of the etching template and is collected preliminarily under the action of the primary lens, so that the laser beam can be controlled to generate a focal point on the surface of a wafer and the size of a spot etched by the laser beam every time is determined. Moreover, the vertical position of the etched focal point can be changed conveniently by replacing the primary lens, so that the size of the spot can be adjusted conveniently to determine the depth and size of a circuit groove formed by etching every time.

Description

technical field [0001] The invention relates to the technical field of laser etching, in particular to a chip silicon wafer laser etching equipment and a chip production process. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8-inch and 12-inch. The main processing methods of wafers are sheet processing and batch processing, that is, one or more wafers are processed at the same time. As semiconductor feature sizes become smaller and processing and measurement equipment become more advanced, laser etching of silicon wafers during silicon wafer processing is an important s...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a chip silicon wafer laser etching equipment, which is convenient for adjusting the focus position of laser etching and the adjustment of etching area. The advantages of precise size and position control solve the problems of inconvenient laser etching focus adjustment and long adjustment time for template replacement

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