Substrate treatment apparatus

Abstract

Disclosed is a substrate treatment apparatus including a rotation unit that supports and rotates a substrate, a chemical discharge unit that discharges a chemical solution to the rotation unit, a chemical recovery unit disposed close to the rotation unit and configured to recover the chemical solution scattering from the rotation unit, and a laser irradiation unit that applies a laser beam to the substrate and heats the substrate. Thus, the temperature of the substrate is adjusted by irradiating the substrate with the laser, and the amount of etching by the chemical solution can be increased.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus that can be used for manufacturing semiconductors. Background technique [0002] As semiconductor elements become denser, more integrated, and more functional, the need for miniaturization of circuit patterns is further increasing. For example, 3D V-NAND flash memory (3D V-NAND flash memory), which is used as a storage element among various semiconductor devices, has been manufactured with 24-layer and 32-layer stacked circuits, and recently with 64-layer stacked circuits. [0003] Circuits stacked in multiple layers should be properly evaporated and etched to be fabricated as designed. Therefore, in order to manufacture 3D V-NAND flash memory with more than 64 layers, excellent etching technology and evaporation technology may be required. [0004] On the other hand, among various processes for manufacturing semiconductor ele...

AI Technical Summary

Problems solved by technology

However, due to the limited etching uniformity and etching amount of conventional etching methods, it may be difficult to meet the miniaturization of circuit patterns.

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