Novel circuit board and manufacturing method thereof
A technology for circuit boards and flexible circuit boards, which is applied in the directions of printed circuit components, secondary processing of printed circuits, and non-metallic protective layer coating, etc. question
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0029] S1, the making of substrate layer 1: select the epoxy board as the substrate of the flexible circuit board, and process it into a track shape with a matching copper wire on the substrate surface, remove the waste debris on the substrate surface after the processing is completed, and obtain the substrate layer 1;
[0030] S2, the production of circuit layer 2: place the copper wire with strong flexibility on the track of the substrate layer 1 with suitable tightness and processing technology, and dry the flexible copper wire on the substrate layer 1 through the drying device, Curing the conductive circuit, so that the copper wire is press-molded inside the track of the substrate layer 1 to obtain the circuit layer 2;
[0031] S3. Pretreatment of raw materials for cover film layer 3: put 10 parts of polyimide resin, 8 parts of isocyanate, 5 parts of leveling aid, 4 parts of stabilizer, 10 parts of inorganic filler and 3 parts of curing agent into the reactor in sequence ,...
Embodiment 2
[0035] S1, the making of substrate layer 1: select the epoxy board as the substrate of the flexible circuit board, and process it into a track shape with a matching copper wire on the substrate surface, remove the waste debris on the substrate surface after the processing is completed, and obtain the substrate layer 1;
[0036] S2, the production of circuit layer 2: place the copper wire with strong flexibility on the track of the substrate layer 1 with suitable tightness and processing technology, and dry the flexible copper wire on the substrate layer 1 through the drying device, Curing the conductive circuit, so that the copper wire is press-molded inside the track of the substrate layer 1 to obtain the circuit layer 2;
[0037] S3. Pretreatment of raw materials for cover film layer 3: Put 11 parts of polyimide resin, 9 parts of isocyanate, 6 parts of leveling aid, 5 parts of stabilizer, 11 parts of inorganic filler and 4 parts of curing agent into the reactor in sequence ,...
Embodiment 3
[0041] S1, the making of substrate layer 1: select the epoxy board as the substrate of the flexible circuit board, and process it into a track shape with a matching copper wire on the substrate surface, remove the waste debris on the substrate surface after the processing is completed, and obtain the substrate layer 1;
[0042] S2, the production of circuit layer 2: place the copper wire with strong flexibility on the track of the substrate layer 1 with suitable tightness and processing technology, and dry the flexible copper wire on the substrate layer 1 through the drying device, Curing the conductive circuit, so that the copper wire is press-molded inside the track of the substrate layer 1 to obtain the circuit layer 2;
[0043] S3. Pretreatment of raw materials for cover film layer 3: put 12 parts of polyimide resin, 10 parts of isocyanate, 7 parts of leveling aid, 6 parts of stabilizer, 12 parts of inorganic filler and 5 parts of curing agent into the reactor in sequence ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| dielectric loss | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More