A resin composition and resin film, prepreg, laminate, copper clad laminate and printed circuit board comprising the same
A resin composition and resin technology, applied in the directions of printed circuits, printed circuit components, circuit substrate materials, etc., can solve the problems of easy aging by thermal oxygen, and achieve high heat resistance, high peel strength, and improved stability. Effect
Active Publication Date: 2022-07-19
GUANGDONG SHENGYI SCI TECH
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- Description
- Claims
- Application Information
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Problems solved by technology
The resin composition also has the problem of being easily aged by heat and oxygen
Method used
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Embodiment 1-10
[0062] The resin composition is prepared according to the components shown in Table 2, and the copper clad laminate samples are made according to the following manufacturing method of the copper clad laminate:
[0063] (1) each component of the formula amount in the resin composition is uniformly mixed in toluene, and uniformly dispersed at room temperature to obtain resin glue;
[0064] (2) Use reinforcing material (Low Dk1035 glass fiber cloth) to impregnate the resin glue obtained in step (1), control the suitable unit weight through the clamping shaft, and bake the sheet in an oven to remove the toluene solvent to obtain a 1035 prepreg. Two sheets of 1035 prepreg are overlapped, and the upper and lower sides are matched with HOZ-thick copper foil, which is vacuum laminated and cured in a press for 120 minutes, and the curing pressure is 25Kg / cm 2 , the curing temperature is 200 ℃, and the copper clad laminate is obtained.
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Abstract
The present invention relates to a resin composition and resin films, prepregs, laminates, copper clad laminates and printed circuit boards comprising the same, the resin composition comprising: thermosetting polyphenylene ether resin, vinyl silicone resin and fully hydrogenated The combination of elastomeric polymers; based on the sum of the addition amounts of the thermosetting polyphenylene ether resin, vinyl silicone resin and fully hydrogenated elastomeric polymer as 100 parts by weight, the fully hydrogenated elastomeric polymer The added amount is 20-50 parts by weight. The copper clad laminate prepared from the resin composition provided by the present invention has low dielectric constant and low dielectric loss, and also has excellent thermal oxidation resistance, high glass transition temperature, high heat resistance and high peel strength. And low water absorption and other characteristics, can be used in more harsh environments such as automotive radar.
Description
technical field [0001] The present invention relates to the technical field of communication materials, in particular to a resin composition and resin films, prepregs, laminates, copper clad laminates and printed circuit boards containing the same. Background technique [0002] For high-frequency electronic circuit substrates, in the long-term use process, the stability of the dielectric constant and dielectric loss of the substrate is maintained, which has a significant impact on the change of the characteristic impedance of the substrate and the signal integrity. In the substrate resin curing system, the resin will undergo thermal oxidative aging during long-term use, and the dielectric constant and dielectric loss of the substrate will increase, thereby affecting its stability and ultimately deteriorating the signal integrity of the substrate. Therefore, good thermal-oxidative aging resistance of the substrate resin curing system is an important performance requirement fo...
Claims
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IPC IPC(8): C08L71/12C08L83/07C08L53/02C08K7/14B32B17/02B32B17/12B32B17/06B32B15/20B32B27/04B32B27/28H05K1/03
CPCC08L71/12B32B5/02B32B5/26B32B15/20B32B15/14H05K1/0366C08L2201/08C08L2205/03B32B2262/101B32B2260/021B32B2260/046B32B2307/306B32B2457/08C08L83/04C08L53/025C08K7/14C08K5/0066C08L71/126C08J5/249C08G77/20C08J5/244C08J2371/12C08J2483/04C08J2453/02C08L53/02C08J5/18C08J2383/07C08L2201/02C08L2203/20
Inventor 陈广兵曾宪平
Owner GUANGDONG SHENGYI SCI TECH