Special treatment process for removing metal nickel impurities in gold plating liquid medicine

A special treatment, metal nickel technology, applied in the field of special treatment process to solve the metal nickel impurities in the gold plating solution, can solve the problems of poor removal effect, inability to remove metal nickel, and general removal effect of metal nickel, etc.

Pending Publication Date: 2021-05-18
SUZHOU PLATER ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is: in order to solve the present traditional method for the removal of metallic nickel in the gold-plating chemical solution, it is generally realized by a simple filtration method, the removal effect of metallic nickel in the solution is general, only for some visible The metal nickel impurities in the solid state can be quickly removed, but some ionic state metal nickel in the gold plating solution cannot be removed, and the removal effect is not good. A special method for solving the metal nickel impurities in the gold plating solution is proposed. Treatment process

Method used

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  • Special treatment process for removing metal nickel impurities in gold plating liquid medicine

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Embodiment 1

[0038] The present invention provides a technical solution: a special treatment process for solving metal nickel impurities in gold-plating liquid, comprising the following steps:

[0039] S1. First introduce the gold-plating liquid into the ion exchanger for ion exchange treatment, increase the temperature in the ion exchanger to 150°C, and react for 25 minutes to obtain a concentrated solution of metal ions in the gold-plated liquid, and then introduce the resulting concentrated liquid into the concentrated In the liquid tank, the separated water is reintroduced into the container for storage;

[0040] S2. Introduce the concentrated solution obtained in the step S1 into the electrochemical reactor, perform a certain degree of electrolytic treatment on the concentrated solution to obtain an electrolyte, and some other impurity metals are adsorbed on the cathode, and the cathode of the electrochemical reactor Using carbon materials;

[0041] S3. For special treatment in the f...

Embodiment 2

[0050] The present invention provides a technical solution: a special treatment process for solving metal nickel impurities in gold-plating liquid, comprising the following steps:

[0051] S1. First, introduce the gold plating solution into the ion exchanger for ion exchange treatment, increase the temperature in the ion exchanger to 160°C, and react for 30 minutes to obtain a concentrated solution of metal ions in the gold plating solution, and then introduce the resulting concentrated solution into the concentrated solution. In the liquid tank, the separated water is reintroduced into the container for storage;

[0052] S2. Introduce the concentrated solution obtained in the step S1 into the electrochemical reactor, perform a certain degree of electrolytic treatment on the concentrated solution to obtain an electrolyte, and some other impurity metals are adsorbed on the cathode, and the cathode of the electrochemical reactor Using carbon materials;

[0053] S3. For special tr...

Embodiment 3

[0062] The present invention provides a technical solution: a special treatment process for solving metal nickel impurities in gold-plating liquid, comprising the following steps:

[0063] S1. First introduce the gold-plating liquid into the ion exchanger for ion exchange treatment, increase the temperature in the ion exchanger to 165°C, and react for 32 minutes to obtain a concentrated solution of metal ions in the gold-plated liquid, and then introduce the resulting concentrated liquid into the concentrated In the liquid tank, the separated water is reintroduced into the container for storage;

[0064] S2. Introduce the concentrated solution obtained in the step S1 into the electrochemical reactor, perform a certain degree of electrolytic treatment on the concentrated solution to obtain an electrolyte, and some other impurity metals are adsorbed on the cathode, and the cathode of the electrochemical reactor Using carbon materials;

[0065] S3. For special treatment in the f...

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Abstract

The invention discloses a special treatment process for removing metal nickel impurities in a gold plating liquid medicine, and belongs to the technical field of metal impurity removal. The process comprises the following steps: firstly introducing the gold plating liquid medicine into an ion exchanger for ion exchange treatment, increasing the temperature in the ion exchanger, and reacting for a period of time. According to the method, the ion exchange step is set, so that a concentrated solution of metal ions in the gold plating liquid medicine can be obtained, and meanwhile, the concentrated solution of the metal ions in the gold plating liquid medicine is electrolyzed by utilizing the electrochemical reactor to generate various different metal ions. Other metal ions can be effectively adsorbed through the negative electrode of the electrochemical reactor, and a solution with nickel ions can be led out and is subjected to reaction filtration through the filtering device subjected to special treatment. The device not only can realize the function of removing impurities from some nickel solid metal particles, but also has the effect of removing some nickel metal ions, so that the overall treatment effect of the process is improved.

Description

technical field [0001] The invention belongs to the technical field of metal impurity removal, and in particular relates to a special treatment process for solving metal nickel impurities in a gold-plating liquid. Background technique [0002] Impurity removal refers to the process of effectively removing impurities contained in the original material without reacting with the main components, and without introducing new impurity components. Any mixture has certain impurities, and some metals will be mixed in some gold-plating liquids. Impurities such as nickel. [0003] Nowadays, the traditional method of removing metal nickel in gold plating solution is generally realized by simple filtration method, and the removal effect of metal nickel in solution is average, and only some visible solid state metal nickel impurities can be quickly removed. However, it is impossible to remove some ionic metal nickel in the gold-plating liquid, and the removal effect is not good, so some ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25C1/08C25C7/06
CPCC25C1/08C25C7/06
Inventor 邓金虎
Owner SUZHOU PLATER ELECTRONICS CO LTD
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