The invention relates to a wafer scribing machine for chip processing, which comprises a bottom plate, a scribing device, a workbench, a cooling mechanism and two cleaning mechanisms, wherein each cleaning mechanism comprises a fixed box, a fixed column, an air cylinder, a piston, an air inlet pipe, an air outlet pipe, a filter screen, an oiling assembly, a fixed block, a driving block, a connecting rope and two air cylinders; wherein the oiling assembly comprises an oiling box, a driving plate, a driving rod, a power rod, two first springs and two oiling units, the cooling mechanism comprisesa water tank, a water inlet pipe, a water spraying pipe, a supporting box, two water squeezing assemblies and two supporting rods, and each water squeezing assembly comprises a moving plate and two limiting units. According to the wafer scribing machine, through the cleaning mechanisms, the impurity removing function is achieved, the friction force between the scribing device and the wafer is prevented from being increased due to adhesion of chippings, so that the scribing work is prevented from being influenced, the scribing quality is improved, the function of cooling the scribing device isachieved through the cooling mechanism, and the scribing device is prevented from being damaged due to overheating.