Nanometer waterproof coating with heat dissipation function and application method thereof

Abstract

The invention discloses a nanometer waterproof coating with a heat dissipation function and an application method thereof. The nanometer waterproof coating with the heat dissipation function is a suspension prepared by adding ceramic nano-powder, nanometer silicon and nanometer titanium into a nanometer waterproof coating solution. According to the nanometer waterproof coating with the heat dissipation function and the application method thereof disclosed by the invention, the nano nanometer waterproof coating with the heat dissipation function can be prepared; nanometer solid components such as the ceramic nano-powder, the nanometer silicon and the nanometer titanium are uniformly distributed in a nanometer waterproof coating film formed by curing, and granular and / or fish scale-shaped bulges are formed on the surface of the nanometer waterproof coating film, so heat is rapidly conducted from the surface of an electronic component to a direction perpendicular to a coating direction, a contact area between the coating and the outside can be increased so as to achieve the heat dissipation effect, and the double functions of waterproof protection and heat conduction and dissipation on the surface of a key part of the electronic component are achieved; and the nanometer waterproof coating is not obviously thickened, so small space in the electronic equipment is not additionally occupied, and the coating is suitable for industrial popularization and application.

Description

technical field [0001] The invention belongs to the technical field of nanometer waterproof paint, and in particular relates to a nanometer waterproof paint with heat dissipation function and an application method thereof. Background technique [0002] At present, with the rapid expansion of the market for portable and wearable electronic products, electronic internal components and circuit board structures are becoming increasingly thinner and smaller in size, and the design sizes of key ICs and chips are also rapidly shrinking. While bringing high-speed computing and communication capabilities, heat dissipation has become a major difficulty. Taking the mobile phone CPU as an example, the operating temperature of conventional mobile phone CPU chips on the market can reach above 70°C, some capacitors can reach above 60°C, and the operating temperature of mobile phone LCD screens can also reach the range of 50-70°C. The wireless charging module is also very easy to cause ene...

AI Technical Summary

Problems solved by technology

Taking the mobile phone CPU as an example, the operating temperature of conventional mobile phone CPU chips on the market can reach above 70°C, some capacitors can reach above 60°C, and the operating temperature of mobile phone LCD screens can also reach the range of 50-70°C. The wireless charging module is also very easy to cause energy to be converted into additional heat energy during the transmission current. The temperature inside the electronic product can actually reach a high level, and the upper limit of the temperature that the mobile phone chip, battery, etc. can withstand is generally only in the 50°C, therefore, if the heat-generating core chips, capacitors, circuits, and peripheral components cannot be cooled quickly, it may cause great damage to the performance and life of electronic components and electronic products, and even cause safety hazards

[0003] In the design of conventional electronic internal components, the most common solution to heat dissipation is to increase the graphite layer for heat dissipation in the plane direction, and use it together with thermally conductive silicone grease or thermally conductive silicone pads for vertical defense line heat dissipation. The fat layer is usually thick (0.5-1mm), which will cause the problem that heat dissipation components occupy more internal design space of electronic products, and some graphite heat conduction sheets are used directly on the heat dissipation surface, and through the thinner 10-30μm double-sided Tape fixing, such as the common application mode in wireless charging modules, and the conventional PET film double-sided tape also has a potential impact on the vertical heat conduction, and will also occupy additional space

Images