Preparation method of polyimide evaporation film
A polyimide and vapor-deposited film technology, which is applied in the field of polyimide vapor-deposited film preparation, can solve the problems of poor quality of polyimide film products, insufficient product refinement, poor electrical insulation of vapor-deposited films, etc. problems, achieving the effects of excellent single-layer insulation, weight and size reduction, and high transparency
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[0017] The present invention will be further described below in conjunction with specific embodiment:
[0018] Prepare the high-purity pyrophthalic anhydride powder with an average particle diameter of 8um and a purity of 99.95% as the first sublimation vapor deposition material, and prepare an average particle diameter of 7um with a purity of 99.8% as the first high-purity pyrophthalic anhydride powder. A sublimation vapor deposition material, using the above two vapor deposition materials, on a quartz plate with a thickness of 1mm, using the resistive heating method to vapor-deposit co-evaporation at the same time, control the content of diamine and bisanhydride in the film to 1:1.01 film, and form a polyimide precursor film sheet, anneal the precursor film at 350 ° C for 5 minutes, imidize to form polyimide, and the finished polyimide film can reach:
[0019] Transmittance Resistivity True Eye Density 85% 500MΩ 100m 2 / indivual
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