Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Inductance element

A technology of inductive components and inductance, which is applied in the direction of electrical components, inductors, fixed inductors, etc., can solve the problems of no boost, small inductors, waste of inductive space, etc.

Pending Publication Date: 2021-06-08
浙江三钛科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing chip inductors only use adhesives to fix the inductor magnets and pins. When the inductor is shaken or vibrated, the adhesive glue used to fix the inductor magnets and pins may loosen, causing the inductor magnets to or pin stripping, resulting in inductive component failure
[0004] The existing high-current inductors with an equivalent number of turns ≤ 1 are mainly assembled. The assembly between the magnet and the conductor requires a matching tolerance. The glue between the magnetic cores has a certain thickness. There is no improvement, resulting in a waste of inductance space, and it is impossible to manufacture inductors with the same performance and smaller volume, or inductors with the same volume and better performance, and there is also a reliability risk of adhesive glue loosening
[0005] Patent CN107749340A discloses a high-reliability high-current molded inductor and its manufacturing method, so that the middle part of the wire is arranged in the magnet and integrated with the magnet, reducing the gap between the magnet and the conductor, but this method only directly connects the wire with the magnet. The magnetic powder is pressed, which is easy to deform the wire during the compression process, which will affect the performance of the inductance element

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Inductance element
  • Inductance element
  • Inductance element

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0034] 1. Preparation of magnetic powder for pressing

[0035] The FeNi50 powder produced by gas atomization is mixed according to the weight ratio of +200 mesh 5%, -200~+325 mesh 25%, -325~+800 mesh 45%, and the balance is -800 mesh powder. pink. Mix silicone resin and alcohol at a weight ratio of 1:15 to prepare a silicone resin solution, mix the original powder with the silicone resin solution at a weight ratio of 1:0.015, and coat the original powder with silicone resin to obtain a secondary powder , screening the granulated powder with a particle size between 80 mesh and 200 mesh in the secondary powder, adding a mixture of calcium stearate and zinc stearate with a weight ratio of 0.2% as a lubricant to obtain a magnetic powder for pressing;

[0036] 2. Molding

[0037] Fill the 4x10x2mm mold with the magnetic powder for pressing prepared in step 1, and then place the 0.5x2.0x18mm copper wire in the mold, and the two ends of the copper wire are clamped in the mold and e...

Embodiment 1

[0111] 1. Preparation of magnetic powder for pressing

[0112] The FeNi50 powder produced by gas atomization is mixed according to the weight ratio of +200 mesh 5%, -200~+325 mesh 25%, -325~+800 mesh 45%, and the balance is -800 mesh powder. pink. The raw powder is added to the aqueous solution of phosphoric acid and silane coupling agent with a weight ratio of phosphoric acid: silane coupling agent: water = 0.5:0.5:99 for surface film formation reaction. The reaction temperature is 100°C and the reaction time is 0.5h. Mix silicone resin and alcohol at a weight ratio of 1:15 to prepare a silicone resin solution, mix the original powder with the silicone resin solution at a weight ratio of 1:0.015, and coat the original powder with silicone resin to obtain a secondary powder ; Screen the granulated powder with a particle size between 80 mesh and 200 mesh in the secondary powder, and add a mixture of calcium stearate and zinc stearate with a weight ratio of 0.2% as a lubricant ...

Embodiment 2

[0124] 1. Preparation of magnetic powder for pressing

[0125] The FeNi50 powder produced by gas atomization is mixed according to the weight ratio of +200 mesh 5%, -200~+325 mesh 25%, -325~+800 mesh 45%, and the balance is -800 mesh powder. pink. Add the original powder to the aqueous solution of chromic acid: silane coupling agent: water = 0.5: 1.5: 98 by weight to carry out surface film-forming reaction. The reaction temperature is 130 °C and the reaction time is 0.3 h. Mix silicone resin and alcohol at a weight ratio of 1:15 to prepare a silicone resin solution, mix the original powder with the silicone resin solution at a weight ratio of 1:0.015, and coat the original powder with silicone resin to obtain a secondary powder ; Screen the granulated powder with a particle size between 80 mesh and 200 mesh in the secondary powder, and add a mixture of calcium stearate and zinc stearate with a weight ratio of 0.2% as a lubricant to obtain a magnetic powder for pressing;

[...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an inductance element, which is prepared by performing high-temperature heat treatment on an inductance compact and comprises a prefabricated bottom blank, a top blank and a wire; the wire is placed on the prefabricated bottom blank, and two ends of the wire are exposed out of the prefabricated bottom blank; the prefabricated bottom blank is provided with a limiting wire groove / limiting check block used for positioning the wire, so that the wire is fixedly placed on the prefabricated bottom blank. The prefabricated bottom blank can be matched with the top blank to form an integrated compact capable of pressing the wire.

Description

technical field [0001] The invention relates to the field of electrical component manufacturing, in particular to an inductance component. Background technique [0002] With the development of the market and the advancement of electronic technology, inductance components are constantly developing towards the goals of high current, high frequency, small size and low power consumption. The frequency and size of the ripple current flowing through the inductor are also increasing, resulting in an increase in the heat generation of the inductor, which puts forward higher requirements for the magnet loss and conductor loss of the inductor, and also requires that the heat generated by the coil and the magnetic core in the inductor be dissipated quickly and effectively. Out, because the heat is more, and the continuous accumulation will increase the operating temperature of the inductor and reduce its efficiency, and may even cause the entire component to burn out. Especially with ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/02H01F41/00H01F17/04
CPCH01F41/0246H01F41/00H01F41/005H01F17/04H01F2017/048
Inventor 柯昕
Owner 浙江三钛科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com