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Temperature control system and temperature control method for semiconductor temperature control

A temperature control and temperature control system technology, applied in the direction of temperature control, control/regulation system, non-electric variable control, etc., can solve the problems of low chip process efficiency, long single process cycle, low temperature control accuracy, etc., to improve the chip Process efficiency, improve temperature control stability and temperature control accuracy, and improve the effect of heating or cooling speed

Active Publication Date: 2021-06-15
BEIJING JINGYI AUTOMATION EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a temperature control system and a temperature control method for semiconductor temperature control, which are used to solve the problems of low temperature control accuracy, slow temperature control speed, long cycle of a single process, and chip manufacturing process in the temperature control device in the prior art. The problem of inefficiency

Method used

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  • Temperature control system and temperature control method for semiconductor temperature control

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Embodiment Construction

[0029] Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but should not be used to limit the scope of the present invention.

[0030] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right" , "vertical", "horizontal", "top", "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing this The embodiments and simplified descriptions of the invention do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed a...

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Abstract

The invention provides a temperature control system and method for semiconductor temperature control, and relates to the field of semiconductor manufacturing equipment. The temperature control system comprises a refrigerating device, a circulating device and a control device. The circulating device comprises a heater, a water tank, a water pump, a first temperature sensor, a second temperature sensor and a control valve. An outlet of the water pump is communicated with an inlet of the refrigerating device, an outlet of the refrigerating device is communicated with a first connector of the control valve and an inlet of the heater, an outlet of the heater is communicated with an inlet of load equipment, an outlet of the load equipment and an outlet of the water tank are jointly connected with an inlet of the water pump, and an inlet of the water tank is communicated with a second connector of the control valve. The control valve is closed when the temperature control system is in a cooling or heating state, so that the amount of heat exchange liquid is reduced, the heating or cooling speed of the temperature control system is increased, the single process cycle is shortened, and the chip manufacturing efficiency is improved. By increasing the amount of the heat exchange liquid in the no-load or load state, the temperature control stability and the temperature control precision of the temperature control system are improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing equipment, in particular to a temperature control system and a temperature control method for semiconductor temperature control. Background technique [0002] Semiconductor temperature control device is an important equipment in the manufacturing process of semiconductor integrated circuit IC. In the etching process of integrated circuit IC manufacturing, it is required to maintain a constant temperature output to control the process chamber of the etching equipment, and the temperature control accuracy is high. In actual use, the semiconductor temperature control device controls the temperature precisely through the cooling and heating links. The current semiconductor temperature control device adopts the traditional PID control algorithm to achieve the same control target temperature and the given temperature. When the load of the etching process equipment fluctuates sharply, the semic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/20
CPCG05D23/20
Inventor 常鑫刘紫阳宋朝阳董春辉冯涛李文博芮守祯何茂栋曹小康
Owner BEIJING JINGYI AUTOMATION EQUIP CO LTD
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