Packaging structure and preparation method thereof

Abstract

The invention discloses a packaging structure and a preparation method thereof. The preparation method comprises the following steps: providing a substrate, wherein the substrate is provided with a first surface and a second surface which are opposite to each other; arranging a box dam on the first surface of the base plate, wherein the box dam comprises an inner layer dam body and an outer layer dam body, the inner layer dam body is arranged in the outer layer dam body in a sleeved mode, the inner layer dam body is made of plastic materials, and the inner layer dam body is provided with a top face, an inner side face and an outer side face, and providing a metal piece, wherein the metal piece is arranged on the inner dam body and covers at least part of the top surface and / or at least part of the inner side surface of the inner dam body. According to the packaging structure obtained by the preparation method, the position of the metal piece can be flexibly arranged according to the packaging requirement, the defects of an existing box dam are overcome, and the packaging requirement is met.

Description

technical field [0001] The present application relates to the field of packaging technology, in particular to a packaging structure and a preparation method thereof. Background technique [0002] Sensors, crystal oscillators, resonators, lasers, camera devices, LED modules and other devices are generally packaged with ceramic substrates. The commonly used packaging structure is to set a dam on a ceramic substrate with a circuit layer, and set a cover on the dam , the cover plate, the dam and the ceramic substrate are surrounded by a sealed chamber, which is used to place various chips and other devices, and the air-tightness of the device is realized by filling the sealed chamber with packaging glue, inert gas or direct vacuuming Pack. [0003] At present, the dams are roughly divided into three types, 1. ceramic dams, 2. metal dams, and 3. plastic dams. Among them, ceramic dams are generally sintered by LTCC (Low Temperature co-fired ceramics, low temperature co-fired cer...

AI Technical Summary

Problems solved by technology

Among them, ceramic dams are generally sintered by LTCC (Low Temperature co-fired ceramics, low temperature co-fired ceramics) technology, so that the resolution of ceramic dam lines is not high, and the cost of forming through high-temperature sintering is high

There are generally three ways to make metal dams. The first method is that the metal dam is formed by stamping a single metal or alloy, and then the metal dam is bonded to the ceramic substrate. In this method, the metal dam and the ceramic substrate There is an organic connection between them, and the airtightness is not good; the second way is to weld the metal dam on the ceramic substrate through the metal kovar ring, which requires high welding technology, resulting in low product yield and high cost; the third way The first way is to make the dam on the ceramic substrate by electroplating. The width of the dam in this way is limited and the process is more complicated.

Plastic dams (including epoxy resin) are poorly resistant to UV (ultraviolet) radiation and cannot be welded on cover plates

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