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Machining method for internal runner structure of cold plate and application of machining method

A processing method and cold plate technology, which are applied to the processing field of the internal flow channel structure of the cold plate, can solve the problems of high cost, complex processing method and high degree of professionalism, shorten the manufacturing cycle, have low equipment requirements, and ensure the dimensional accuracy of parts. Effect

Inactive Publication Date: 2021-06-22
SICHUAN JIUZHOU ELECTRIC GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a processing method for the internal flow channel structure of the cold plate, which solves the problems of complex operation, high professionalism and high cost in the existing processing method of the internal flow channel structure of the cold plate

Method used

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  • Machining method for internal runner structure of cold plate and application of machining method
  • Machining method for internal runner structure of cold plate and application of machining method
  • Machining method for internal runner structure of cold plate and application of machining method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] A method for processing an internal flow channel structure of a cold plate, comprising the following steps:

[0053] S1. Drill a pre-hole on the side wall of the cold plate, and use a wire cutting molding process to form a flow channel according to the pre-hole, and the cross-section of the flow channel is circular;

[0054] The specific process of wire cutting molding process is as follows:

[0055] 1) According to the actual size of the through hole or the through frame, drill the wire and cut the pre-hole;

[0056] 2) After alignment through the shape and pre-hole positioning, draw the wire path on the operation interface of the wire cutting machine tool;

[0057] 2) The diameter of the molybdenum wire used for processing is Φ0.18㎜, the processing voltage is 80V, the maximum current is 3A, and the cutting speed is 20㎜ 2 / min to set parameters to complete the processing of the flow channel through hole;

[0058] 3) After the processing is completed, clean the wire ...

Embodiment 2

[0072] A method for processing an internal flow channel structure of a cold plate, comprising the following steps:

[0073] S1. Drill a pre-hole on the side wall of the cold plate, and use a wire cutting molding process to form a flow channel according to the pre-hole, and the cross-section of the flow channel is circular;

[0074] The specific process of wire cutting molding process is as follows:

[0075] 1) According to the actual size of the through hole or the through frame, drill the wire and cut the pre-hole;

[0076] 2) After alignment through the shape and pre-hole positioning, draw the wire path on the operation interface of the wire cutting machine tool;

[0077] 2) The diameter of the molybdenum wire used for processing is Φ0.18㎜, the processing voltage is 80V, the maximum current is 3A, and the cutting speed is 20㎜ 2 / min to set parameters to complete the processing of the flow channel through hole;

[0078] 3) After the processing is completed, clean the wire ...

Embodiment 3

[0088] A method for processing an internal flow channel structure of a cold plate, comprising the following steps:

[0089] S1. Drill pre-holes on the two symmetrical side walls of the cold plate, adopt the drilling process on both sides, and use the wire cutting molding process to form the flow channel according to the pre-hole, and the cross-section of the flow channel is circular;

[0090] The specific process of wire cutting molding process is as follows:

[0091] 1) Scribing and aligning, marking the center of the holes on both sides; or the center holes on both sides of the clamping point on the CNC equipment; then drill pre-holes from both sides, pay attention to the drilling depth should be greater than half the length of the through hole;

[0092] 2) After using the shape of the cold plate and the pre-hole positioning to align, draw the wire path on the operation interface of the wire cutting machine;

[0093] 3) The diameter of the molybdenum wire used for processin...

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Abstract

The invention discloses a machining method for an internal runner structure of a cold plate and application of the machining method. The machining method comprises the following steps: S1, drilling a pre-hole in the side wall of a cold plate, and forming a runner according to the pre-hole by adopting a cutting machining mode; and S2, welding plugs to the two ends of the runner by silver brazing or laser welding or argon arc welding, wherein the plugs and the cold plate are made of the same material. According to the runner machining method, cutting machining is conducted firstly, and then welding is conducted. On one hand, compared with the mode that parts are split into two halves and then assembled and welded, the machining method has the advantages that the technological process is more simplified, and the production period is shortened. On the other hand, the requirement on welding equipment is relatively low, the manufacturing difficulty is lowered, and wide application range is achieved. Compared with an existing widely-adopted machining mode, the machining method has the advantages that the efficiency is greatly improved, and the cost is correspondingly reduced.

Description

technical field [0001] The invention relates to the technical field of electronic product processing, in particular to a processing method and application of a flow channel structure inside a cold plate. Background technique [0002] As electronic products increasingly show the characteristics of miniaturization, modularization and integration, the electronic devices applied to them also reflect the characteristics of small size, multi-function and high power consumption. At the same time, the modules also have the feature of centralized installation, so the heating problem of electronic products becomes more and more prominent. The cooling system has three schemes: natural cooling, air cooling, and liquid cooling. Due to the increase in device heating power and the shrinkage of the heat dissipation area caused by the miniaturization of modules, natural cooling and air cooling have become increasingly difficult to meet the needs of electronic products. Therefore, more and m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 黄丽媛任清川周永王强
Owner SICHUAN JIUZHOU ELECTRIC GROUP
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