Preparation method of single-component high-fluidity high-thermal-conductivity gel

A high fluidity, high thermal conductivity technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problems of unstable storage, slow extrusion speed, and high thermal resistance, so as to facilitate later repairs and have good fluidity. , the effect of high extrusion rate

Inactive Publication Date: 2021-06-25
福建臻璟新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Thermally conductive gels are divided into two categories: two-component thermally conductive gels and single-component thermally conductive gels. The single-component gels are not divided into A and B components. The production and tube equipment are simple, easy to use, and do not need to be When mixing the glue, there is no problem of uneven mixing, but it is not stable when stored at room temperature, and it is easy to solidify and agglomerate
In order to solve this contradiction, some products on the market use the method of adding a polymerization inhibitor to delay the crosslinking speed, but they must be stored at low temperature, transportation and use are inconvenient, and it is difficult to truly ensure product stability; the so-called thorough pre-cured products on the market are actually Mixed with a large proportion of methyl silicone oil, it is not 100% real gel, generally has poor fluidity, slow extrusion speed, and high thermal resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0021] A method for preparing a single-component high-flowability and high-thermal-conductivity gel, the above-mentioned preparation method includes the following steps in parts by weight:

[0022] Step S1, add 2g of fumed silica with a particle size of 200nm into 10g of absolute ethanol and stir evenly, add 1g of platinum catalyst dropwise into absolute ethanol while stirring, stop stirring after stirring for 10 minutes, and spread out at 50°C Dry in the environment to obtain dry white powder A;

[0023] Step S2: Slowly add 1g of polyvinyl alcohol powder into 100g of deionized water at a stirring speed of 300r / min, then heat up to 50°C, increase the speed to 1000r / min, and stir until completely dissolved to form a colorless Transparent gel solution to obtain solution B;

[0024] Step S3, under the condition that the stirring speed is 1800r / min, add the white powder A of step S1 into the solution B of step S2, disperse and dissolve evenly, increase the speed to 40000r / min and...

Embodiment approach 2

[0027] A method for preparing a single-component high-flowability and high-thermal-conductivity gel, the above-mentioned preparation method includes the following steps in parts by weight:

[0028] Step S1, add 10g of fumed silica with a particle size of 10nm into 15g of absolute ethanol and stir evenly, add 1g of platinum catalyst dropwise into absolute ethanol while stirring, stop stirring after stirring for 10 minutes, and spread out at 50°C Dry in the environment to obtain dry white powder A;

[0029] Step S2, under the condition that the stirring speed is 300r / min, slowly add 0.1g polyvinyl alcohol powder into 100g deionized water, then heat up to 50°C, increase the speed to 1000r / min, stir until completely dissolved, and form no Color transparent gel solution, obtains solution B;

[0030] Step S3, under the condition that the stirring speed is 1800r / min, add the white powder A of step S1 into the solution B of step S2, disperse and dissolve evenly, increase the speed to...

Embodiment approach 3

[0033] A method for preparing a single-component high-flowability and high-thermal-conductivity gel, the above-mentioned preparation method includes the following steps in parts by weight:

[0034] Step S1, add 5g of fumed silica with a particle size of 100nm into 12g of absolute ethanol and stir evenly, add 1g of platinum catalyst dropwise into absolute ethanol while stirring, stop stirring after stirring for 10 minutes, and spread out at 50°C Dry in the environment to obtain dry white powder A;

[0035] Step S2: Slowly add 5g of polyvinyl alcohol powder into 100g of deionized water at a stirring speed of 300r / min, then heat up to 50°C, increase the speed to 1000r / min, and stir until completely dissolved to form a colorless Transparent gel solution to obtain solution B;

[0036] Step S3, under the condition that the stirring speed is 1800r / min, add the white powder A of step S1 into the solution B of step S2, disperse and dissolve evenly, increase the speed to 40000r / min and...

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Abstract

The invention relates to a preparation method of a single-component high-fluidity high-thermal-conductivity gel, the preparation method of the single-component high-fluidity high-thermal-conductivity gel comprises the following production steps: firstly adsorbing a platinum catalyst by using nano fumed silica, then wrapping the platinum catalyst with polymer resin, mixing 0.1-1 part of pretreated platinum catalyst and 80-95 parts of heat-conducting powder, wherein the heat-conducting powder is a mixture of spherical aluminum oxide, silicon nitride and boron nitride, and then mixing with 4-20 parts of silicone oil uniformly, wherein the silicone oil is a mixture of vinyl silicone oil and hydrogen-containing silicone oil, and the ratio of the vinyl silicone oil to the hydrogen-containing silicone oil is (10-20): 1. The gel is stable at normal temperature, and can be quickly cured after being heated to 100-150 DEG C to form an elastic film. The gel can be stored at room temperature for a long time and is stable, good in fluidity, high in automatic dispensing extrusion rate, easy to peel after being heated and cured, free of polluting components and convenient for later repair.

Description

technical field [0001] The invention relates to the technical field of thermal interface materials, in particular to a preparation method of a single-component high-fluidity high-thermal-conduction gel. Background technique [0002] Thermal interface material is a general term for a class of materials that are coated between heat dissipation devices and heat generating devices to reduce the contact thermal resistance between the two. When two surfaces are in contact, due to the structure or surface roughness, there will be some gaps, and the thermal conductivity of air is very small, which will cause a large contact thermal resistance, hinder heat transfer and cause overheating of electronic components . The thermal interface can fill this gap, effectively reducing the contact thermal resistance between the interfaces and improving the heat dissipation performance. Among them, the thermally conductive gel is a flowable paste before curing, which can effectively fill the in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/32C09K5/14
CPCC04B26/32C09K5/14C04B24/2623C04B14/064C04B22/04C04B24/026C04B24/42C04B14/328
Inventor 林伟毅陈智
Owner 福建臻璟新材料科技有限公司
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