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Long-storage-period low-temperature-curing epoxy resin-based prepreg and preparation method thereof

A technology for curing epoxy resin and solid epoxy resin, which is applied in the field of long-storage low-temperature curing epoxy resin-based prepreg and its preparation, and can solve problems such as not being able to meet time requirements

Active Publication Date: 2021-06-29
SHANDONG NON METALLIC MATERIAL RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]It is rare to prepare low-temperature curing composite materials in the form of prepreg, mainly because the general low-temperature curing resin system has a pot life of only a few hours. Curing will occur soon after impregnation, which cannot meet the time requirements of prepreg, cutting, laying up and other processes when some parts are manufactured with prepreg

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Weigh 50 parts of E-51 epoxy resin and 50 parts of E-20 epoxy resin and mix them in a beaker, stir and melt at 80°C, the stirring speed is 150rpm, and the stirring time is 1h to obtain a uniform and stable mixed solution, and then cool to After 40°C, add 5 parts of LycureM-10 curing agent and continue to stir at a stirring speed of 150rpm for 15min, and cool to room temperature to obtain a low-temperature curing epoxy resin system;

[0031] Then put it into the glue tank of the film coating machine and heat the resin base material to 40°C. At this temperature, the viscosity of the resin system is 16Pa·S. Lay the release paper required for the preparation of the film, and adjust the gap between the glue rollers to 0.02mm, the surface density of the resin film is 25g / m 2 , start the adhesive film machine to prepare the epoxy resin film, detect the thickness of the film through the infrared ray meter, cool, and wind up, and obtain the resin film covered with release paper ...

Embodiment 2

[0038] Weigh 34 parts of TDE-85 epoxy resin and 66 parts of E-12 epoxy resin and mix them in a beaker, stir and melt at 80°C, stirring speed 500rpm, stirring time 2h, to obtain a uniform and stable mixed solution, and then cool to After 40°C, add 7 parts of Lycure M-10 curing agent and continue stirring at a stirring speed of 300rpm for 20min, and cool to room temperature to obtain a low-temperature curing epoxy resin system;

[0039] Then put it into the glue tank of the film coating machine and heat the resin base material to 40°C. The viscosity of the resin system at this temperature is 33Pa·S; lay the release paper required for the preparation of the film, and adjust the gap between the glue rollers to 0.08mm, the surface density of the resin film is 100g / m 2 , start the adhesive film machine to prepare the epoxy resin film, detect the thickness of the film through the infrared ray meter, cool, and wind up, and obtain the resin film covered with release paper on both sides...

Embodiment 3

[0047] Weigh 40 parts of F-35 epoxy resin, 20 parts of AG-80 epoxy resin and 40 parts of F j -43 epoxy resin mixed in a beaker, stirred at 90°C to melt, stirring speed 1000rpm, stirring time 1.5h, to obtain a uniform and stable mixture, then cooled to 40°C and added 10 parts of Lycure M-10 curing agent to continue Stir, stirring speed 500rpm, stirring time 30min, cool to room temperature, obtain low-temperature curing epoxy resin system;

[0048] Then put it into the glue tank of the film coating machine and heat the resin base material to 40°C. The viscosity of the resin system at this temperature is 25Pa·S; lay the release paper required for the preparation of the film, and adjust the gap between the glue rollers to 0.06mm, the surface density of the resin film is 75g / m 2 , start the adhesive film machine to prepare the epoxy resin film, detect the thickness of the film through the infrared ray meter, cool, and wind up, and obtain the resin film covered with release paper o...

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Abstract

The invention belongs to the technical field of composite materials, and particularly provides a low-temperature-curing epoxy resin-based prepreg with a relatively long room-temperature storage period and a preparation method thereof. A resin system of the prepreg is formed by mixing a Lycure M-10 latent low-temperature curing agent, solid epoxy resin and liquid epoxy resin; reinforced fibers in the prepreg can be carbon fibers, glass fibers, aramid fibers and the like and fabric forms thereof; and the prepreg is prepared by adopting a hot melting process. The preparation method comprises the following steps: firstly, preparing a resin adhesive film at 40 DEG C by adopting a film coating machine, then compounding the resin adhesive film and the reinforced fibers on a prepreg at 40-45 DEG C, and then conducting cooling, trimming, laminating and rolling to obtain the low-temperature-curing prepreg. The prepreg has the advantages that a preparation temperature is low, a curing temperature is low, curing time is short, room-temperature working life is long, batch preparation can be realized, the performance is not greatly different from the performance of a high-temperature cured prepreg, the internal stress in the curing process of the composite material and the manufacturing energy consumption of the composite material can be reduced, and the preparation efficiency of the composite material is improved.

Description

technical field [0001] The invention belongs to the field of composite materials, and in particular relates to a long-storage low-temperature curing epoxy resin-based prepreg and a preparation method thereof. Background technique [0002] Prepreg is composed of resin and reinforcing fiber. It is an important intermediate material for the preparation of resin-based composite materials. The composite material manufactured by the prepreg process has the characteristics of accurate resin content and stable product quality. Many critical parts are It is preferred to use the prepreg process to manufacture. According to different curing temperatures, prepregs can be divided into high-temperature curing, medium-temperature curing and low-temperature curing prepregs. At present, high-temperature curing and medium-temperature curing prepregs are more practically used. Long pot life and relatively mature preparation process, but the curing temperature is usually above 120°C, even as h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/06C08K7/14C08L77/10C08J5/24
CPCC08J5/24C08J2363/00C08J2463/00C08K7/06C08K7/14C08J2477/10
Inventor 王志远陈刚王启芬于倩倩崇林吴忠泉王忠郑志才魏化震
Owner SHANDONG NON METALLIC MATERIAL RES INST
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