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Green nano-coating device and method for continuous coating of micron-scale bonding wire

A bonding wire and micron-scale technology, which is applied in the field of green nano-coating devices for continuous coating of micron-scale bonding wires and wires, can solve the problems of natural ecological environment hazards of organic halogen compounds, unstable coating quality, etc. The effect of plating process, improving service life and service performance, and improving utilization rate

Active Publication Date: 2022-06-03
HENAN UNIV OF SCI & TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a green nano-coating device and method for continuous coating of micron-scale bonding wires to overcome the problem of unstable coating quality caused by the electroplating and then drawing process in the above-mentioned prior art. problem, and the problem that the organic halogen compound added in the coating solution is harmful to the human body and the natural ecological environment

Method used

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  • Green nano-coating device and method for continuous coating of micron-scale bonding wire
  • Green nano-coating device and method for continuous coating of micron-scale bonding wire
  • Green nano-coating device and method for continuous coating of micron-scale bonding wire

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Embodiment 1

[0040] This embodiment provides a coating solution, which includes the following components by mass percentage: 15% of nano-palladium with a size of 10 nm, 77% of a solvent, and 8% of an additive; wherein, in terms of mass percentage, the solvent includes 22% Ethanol, 20% ethylene glycol, 20% polyethylene glycol 600 and 15% polyethylene glycol 800; additives include dispersants (3% oleic acid and 0.5% octylphenol ethoxylate), corrosion inhibitors (2 % modified phytate), film former (2% polyacrylamide modified rosin) and conditioner (0.5% glutamic acid).

[0041] In this embodiment, the preparation method of the coating solution is as follows: firstly, the additive is dissolved in the solvent to obtain a solution; then 10 nm nano-palladium is added to the above solution, stirred for 6 hours and then sonicated for 12 hours to form a uniform coating solution, and finally The coating solution was obtained by performing pressure filtration under a 50 μm filter to remove impurities....

Embodiment 2

[0047] This embodiment provides a coating solution, which includes the following components by mass percentage: 5% single-layer graphene nanosheets, 82% solvent, and 13% additive; wherein, in terms of mass percentage, the solvent includes 17% Ethanol, 20% ethylene glycol, 25% polyethylene glycol 600 and 20% polyethylene glycol 800; additives include dispersants (5% oleic acid and 1% sodium dodecylbenzenesulfonate), corrosion inhibitors ( 2% polyaspartic acid), film former (3.5% polyacrylamide modified rosin and 1% chitosan) and conditioner (0.5% arginine).

[0048] The preparation method of the coating solution in this embodiment is as follows: firstly, the additive is dissolved in the solvent to obtain a solution; then the single-layer graphene nanosheets are added to the above solution, ultrasonicated for 12 hours, to form a uniform coating solution, and finally a 300 μm coating solution is formed. After pressure filtration is performed under the filter screen to remove impu...

Embodiment 3

[0051] This embodiment provides a coating solution, which includes the following components by mass percentage: 30% tetraammonium palladium sulfate, 60% solvent, and 10% additive; wherein, by mass percentage, the solvent includes 25% ethanol, 20% polyethylene glycol 600 and 15% polyethylene glycol 800; additives include dispersant (5% oleic acid and 1% octylphenol ethoxylate), corrosion inhibitor (1% modified phytate ), film former (2% polyacrylamide modified rosin) and conditioner (1% arginine).

[0052] The preparation method of the coating solution in this embodiment is as follows: firstly, the additive is dissolved in a solvent to obtain a solution; then, tetraammonium palladium sulfate is added to the above solution, stirred for 6 hours, and then ultrasonicated for 12 hours to form a uniform coating solution. The coating solution was obtained by performing pressure filtration under a 50 μm filter to remove impurities.

[0053] The embodiments of the present invention als...

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Abstract

The invention provides a green nano-coating device and method for continuous coating of micron bonding wires. The coating device in the present invention ensures the continuous and stable coating process and improves the service life and service performance of the bonding wire; the coating method makes the coating material deposit and attach to the surface of the bonding wire to form a uniform coating, avoiding the electroplating process Problems such as environmental pollution, wire interruption during drawing process and coating shedding, etc., avoid the problem of unstable coating quality caused by electroplating first and then drawing process.

Description

technical field [0001] The invention belongs to the technical field of packaging bonding wires, and in particular relates to a green nano-coating device for continuous coating of micron-level bonding wires and a method thereof. Background technique [0002] With the rapid development of the integrated circuit industry, the requirements for chip integration are getting higher and higher. Bonding copper wires and silver wires are easy to corrode (oxidize) in the practical application of microelectronic packaging, and are easy to fail in high temperature and high humidity environment. In order to effectively improve the corrosion resistance of copper or silver wires and the reliability of devices in high temperature and high humidity environments, it is usually necessary to add coatings on the surface of copper or silver wires to improve their service performance, and gradually replace them in large-scale integrated circuits and LEDs. Bonding wires are used to connect chips an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C11/10B05C9/14B05D7/20B05D3/00B05D3/02
CPCB05C11/1002B05C11/1005B05C11/1039B05C9/14B05D7/20B05D3/002B05D3/0272B05D2202/45B05D2256/00B05D2401/10B05D2401/20B05D2401/21C23C26/00B82Y30/00C01B32/194B82Y40/00B05C5/0241B05C9/12
Inventor 宋克兴胡浩程浩艳曹军吕长春周延军陈鼎彪丁雨田丁勇李韶林卢伟伟
Owner HENAN UNIV OF SCI & TECH