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Green nano coating device and method for continuous coating of micron-sized bonding wire rod

A bonding wire and micron-level technology, which is applied in the field of green nano-coating devices for continuous coating of micron-level bonding wires, can solve problems such as unstable coating quality and natural ecological environment hazards of organic halogen compounds, and achieve the goal of ensuring coating quality. Effect of plating process, strengthening bonding strength and improving utilization rate

Active Publication Date: 2021-07-02
HENAN UNIV OF SCI & TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a green nano-coating device and method for continuous coating of micron-scale bonding wires to overcome the problem of unstable coating quality caused by the electroplating and then drawing process in the above-mentioned prior art. problem, and the problem that the organic halogen compound added in the coating solution is harmful to the human body and the natural ecological environment

Method used

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  • Green nano coating device and method for continuous coating of micron-sized bonding wire rod
  • Green nano coating device and method for continuous coating of micron-sized bonding wire rod
  • Green nano coating device and method for continuous coating of micron-sized bonding wire rod

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Embodiment 1

[0040] The present embodiment provides a kind of coating solution, and this coating solution comprises the following components by mass percentage: size is the nano-palladium 15% of 10nm, solvent 77%, additive 8%; Wherein, according to mass percentage, solvent comprises 22% Ethanol, 20% ethylene glycol, 20% polyethylene glycol 600 and 15% polyethylene glycol 800; additives include dispersant (3% oleic acid and 0.5% octylphenol ethoxylate), corrosion inhibitor (2 % modified phytate), film former (2% polyacrylamide modified rosin) and regulator (0.5% glutamic acid).

[0041] The preparation method of the coating solution in this embodiment is as follows: first, the additive is dissolved in a solvent to obtain a solution; then 10nm nano-palladium is added to the above solution, first stirred for 6 hours and then ultrasonically for 12 hours to form a uniform coating solution, and finally in the After pressing and filtering under a 50μm filter to remove impurities, the coating solu...

Embodiment 2

[0047] The present embodiment provides a kind of coating liquid, and this coating liquid comprises the following components by mass percentage: 5% single-layer graphene nanoplatelet, solvent 82%, additive 13%; Wherein, according to mass percentage, solvent comprises 17% Ethanol, 20% ethylene glycol, 25% polyethylene glycol 600, and 20% polyethylene glycol 800; additives include dispersants (5% oleic acid and 1% sodium dodecylbenzenesulfonate), corrosion inhibitors ( 2% polyaspartic acid), film former (3.5% polyacrylamide modified rosin and 1% chitosan) and regulator (0.5% arginine).

[0048] The preparation method of the coating solution in this embodiment is as follows: first, the additive is dissolved in a solvent to obtain a solution; then the single-layer graphene nanosheets are added to the above solution, and ultrasonicated for 12 hours to form a uniform coating solution. After press filtration under the filter screen to remove impurities, the coating solution is obtaine...

Embodiment 3

[0051] This embodiment provides a kind of coating liquid, and this coating liquid comprises the following components by mass percentage: 30% tetraammonium palladium sulfate, solvent 60%, additive 10%; Wherein, according to mass percentage, solvent comprises 25% ethanol, 20% polyethylene glycol 600 and 15% polyethylene glycol 800; additives include dispersant (5% oleic acid and 1% octylphenol ethoxylate), corrosion inhibitor (1% modified phytate ), film former (2% polyacrylamide modified rosin) and regulator (1% arginine).

[0052] The preparation method of the coating solution in this embodiment is as follows: first, the additive is dissolved in a solvent to obtain a solution; then tetraammonium palladium sulfate is added to the above solution, first stirred for 6 hours and then ultrasonically for 12 hours to form a uniform coating solution, and finally in After pressing and filtering under a 50μm filter to remove impurities, the coating solution is obtained.

[0053] In the ...

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Abstract

The invention provides a green nano coating device and method for continuous coating of a micron-sized bonding wire rod. The coating device ensures that the coating process is continuous and stable, the service life of the bonding wire rod is prolonged, and the service performance of the bonding wire rod is improved. According to the coating method, a coating material is deposited and attached to the surface of the bonding wire rod to form a uniform coating, so that the problems of environmental pollution caused by an electroplating process, wire breakage in a drawing process, coating falling and the like are avoided, and the problem of unstable coating quality caused by a process of drawing after electroplating is avoided.

Description

technical field [0001] The invention belongs to the technical field of packaging bonding wires, and in particular relates to a green nano-coating device and method for continuous coating of micron-level bonding wires. Background technique [0002] With the rapid development of the integrated circuit industry, the requirements for chip integration are getting higher and higher. Bonding copper wires and silver wires are easy to corrode (oxidize) in the actual application of microelectronic packaging, and are prone to failure in high temperature and high humidity environments. In order to effectively improve the corrosion resistance of copper wires or silver wires and the reliability of devices in high temperature and high humidity environments, it is usually necessary to add a coating to the surface of copper wires or silver wires to improve their service performance, and gradually replace them in large-scale integrated circuits and LEDs Bonding gold wires are used to connect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/10B05C9/14B05D7/20B05D3/00B05D3/02
CPCB05C11/1002B05C11/1005B05C11/1039B05C9/14B05D7/20B05D3/002B05D3/0272B05D2202/45B05D2256/00B05D2401/10B05D2401/20B05D2401/21C23C26/00B82Y30/00C01B32/194B82Y40/00B05C5/0241B05C9/12
Inventor 宋克兴胡浩程浩艳曹军吕长春周延军陈鼎彪丁雨田丁勇李韶林卢伟伟
Owner HENAN UNIV OF SCI & TECH