Unlock instant, AI-driven research and patent intelligence for your innovation.

Conductive adhesive tape and preparation process thereof, and circuit construction device using conductive adhesive tape

A technology of conductive tape and conductive coating, used in electronic circuit testing, printed circuits, measuring devices, etc., can solve the problems of intricately overlapping wires, inability to test, and difficulty in ensuring reliability, and achieve easy portability, easy modification, and compatibility. Concise effect

Pending Publication Date: 2021-07-02
零零壹(苏州)检测技术有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If you use paper and pen to draw pictures to analyze the circuit, it is inevitable that there will be miscalculations and omissions, and it cannot be tested, so it is difficult to guarantee reliability
Circuits built with wires are intricately overlapped, making it difficult to organize and troubleshoot

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conductive adhesive tape and preparation process thereof, and circuit construction device using conductive adhesive tape
  • Conductive adhesive tape and preparation process thereof, and circuit construction device using conductive adhesive tape
  • Conductive adhesive tape and preparation process thereof, and circuit construction device using conductive adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0034] A kind of preparation technology of conductive adhesive tape, comprises the following steps:

[0035] Step 1): making polyvinyl chloride into a carrier tape with a thickness of 0.4-0.6 mm;

[0036] Step 2): coating one side of the carrier tape prepared in step 1) with a 0.1-0.2 mm silicone release layer;

[0037] Step 3): mixing and stirring 40-50 parts by weight of epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer and 6-10 parts by weight of plasticizer;

[0038] Step 4): heating and stirring 4-10 parts by weight of the tackifier until melting;

[0039] Step 5): Slowly add the product of step 3) to the product of step 4), stirring until melting;

[0040]Step 6): In an ice-water bath, add 1 to 10 milliliters of 98wt% concentrated sulfuric acid to the three-necked flask, then add 1 to 100 grams of graphite and 1 to 10 grams of sodium nitrate in turn, and slowly add 1 to 10 grams of sodium nitrate under stirring. 20 grams of potassium permanganat...

Embodiment 1

[0047] Embodiment 1: take the epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer of 40 parts by weight, the plasticizer of 6 parts by weight, take the tackifier of 4 parts by weight, take 20 parts by weight 20 parts by weight of mercapto-functionalized graphene and 20 parts by weight of metal powder are used to prepare a conductive coating according to the above steps.

Embodiment 2

[0048] Embodiment 2: take the epoxidized styrene-diene-styrene block copolymer thermoplastic elastomer of 43 parts by weight, the plasticizer of 6 parts by weight, take the tackifier of 4 parts by weight, take 20 parts by weight 20 parts by weight of mercapto-functionalized graphene and 20 parts by weight of metal powder are used to prepare a conductive coating according to the above steps.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of electrical equipment, and particularly relates to a conductive adhesive tape and a preparation process thereof, and a circuit construction device using the conductive adhesive tape, the conductive adhesive tape comprises a polyvinyl chloride carrier tape, one side of the polyvinyl chloride carrier tape is coated with a conductive coating, and the other side of the polyvinyl chloride carrier tape is coated with an organic silicon anti-sticking layer. The circuit construction device comprises a box body, and a raw material disc and a storage disc are rotatably installed in the box body. A belt end fixing device is arranged on the turntable I; and a turntable II is mounted on the mounting column; and a conductive adhesive tape is wound on the turntable II. According to the invention, the conductive coating can be adhered to a target plane, and a conductive test circuit is drawn, so that a circuit diagram capable of being electrified is constructed, and an electrician can analyze the circuit conveniently; the conductive adhesive tape is convenient to carry, the drawn circuit is convenient to modify, and the test circuit has the simplicity of a paper-pen circuit diagram and the testability of a traditional test circuit.

Description

technical field [0001] The invention belongs to the technical field of electrical equipment, and in particular relates to a conductive adhesive tape, a preparation process thereof, and a circuit construction device using the conductive adhesive tape. Background technique [0002] When an electrical engineer analyzes a circuit, he usually needs to construct a circuit diagram to assist in the analysis. In the prior art, electrical engineers usually draw pictures with pen and paper, or use wires to build test circuits. If you use pen and paper to draw pictures to analyze the circuit, it is inevitable that there will be miscalculations and omissions, and it cannot be tested, so it is difficult to guarantee reliability. Circuits built with wires are intricately overlapped, making it difficult to sort out and troubleshoot faults. Contents of the invention [0003] In view of the above disadvantages, the object of the present invention is to provide a conductive adhesive tape a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/24C09J7/30C09J9/02C09J153/02C09J11/04B65H18/10G01R31/28H05K3/04
CPCC09J7/245C09J7/30C09J9/02C09J153/025C09J11/04B65H18/10G01R31/2898H05K3/043C08K2003/0806C08K2003/0831C08K2003/0812C08K2003/085C08K3/08C08K9/06C08K3/042
Inventor 郭泽生赵晓宏胡景山但文德周益奇
Owner 零零壹(苏州)检测技术有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More