Composite phase change flat plate heat pipe for satellite

A flat heat pipe and composite technology, applied in the field of thermal management, can solve problems such as low thermal conductivity, affecting energy storage rate, and large temperature difference

Inactive Publication Date: 2021-07-06
SHANGHAI SATELLITE ENG INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the thermal conductivity of paraffin phase change materials used at room temperatu...

Method used

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  • Composite phase change flat plate heat pipe for satellite
  • Composite phase change flat plate heat pipe for satellite
  • Composite phase change flat plate heat pipe for satellite

Examples

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Embodiment 1

[0036] Embodiment 1: This embodiment is in the shape of a flat cube with a specific size of 280mm×280mm×20mm, and the interior is divided into a temperature uniform layer and a phase change layer.

[0037] The uniform temperature layer is in the shape of a flat square, with a specific size of 280mm×280mm×10mm, the wall thickness of the cover plate 1 and the bottom are both 3mm, and the depth of the inner cavity is 4mm. The uniform temperature layer uses a matrix of supporting ribs 6 to strengthen the mechanical properties. The supporting ribs 6 are square. The size of each supporting rib 6 is 6mm×6mm, the height is 4mm, and the spacing is 14mm. The material used is aluminum.

[0038] The phase change layer is in the shape of a flat square, with a specific size of 280mm×280mm×10mm and a wall thickness of 3mm. The upper wall is the bottom surface of the temperature uniform layer, which is welded as a whole by diffusion welding. The phase change layer strengthens the heat exchan...

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Abstract

The invention provides a composite phase change flat plate heat pipe for a satellite. The composite phase change flat plate heat pipe comprises a cover plate, a uniform temperature plate, a phase change plate, a first capillary core, a second capillary core, a liquid working medium and a phase change material; the lower side of the cover plate is fixedly connected with the uniform temperature plate, a first sealing chamber is formed between the cover plate and the uniform temperature plate, the lower side of the uniform temperature plate is fixedly connected with the phase change plate, a second sealing chamber is formed between the uniform temperature plate and the phase change plate, the first capillary core is installed on the upper side of the first sealing chamber, the second capillary core is installed on the lower side of the first sealing chamber, the liquid working medium is added into the first sealing chamber, and the phase change material is added into the second sealing chamber. A uniform temperature layer and a phase change layer are welded into a whole, the thickness of the composite phase change flat plate heat pipe is reduced, meanwhile, light metal fins with high heat conductivity are used as a strengthening structure, the mechanical strength and the pressure bearing capacity of a shell are enhanced, meanwhile, the heat conductivity coefficient of the paraffin phase change material is increased, and the weight of a thermal control device is effectively reduced.

Description

technical field [0001] The invention relates to the technical field of thermal management, in particular to a composite phase-change flat heat pipe for satellites. Background technique [0002] With the development of aerospace technology, many high-power electronic and optical stand-alone units carried on spacecraft adopt modular design. There are multiple electronic / optical components distributed inside the single machine, and these devices often have the characteristics of short-term periodic work and narrow working temperature range. If its own heat cannot be dissipated in time and effectively, the temperature of the device will rise sharply. Excessive temperature will degrade the performance of the device, and more seriously, it will lead to an increase in the failure rate of the device, reducing its stability and reliability, thereby affecting the performance and life of the entire stand-alone device. The temperature difference between devices is also likely to form ...

Claims

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Application Information

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IPC IPC(8): F28D15/04F28F9/007F28F9/26F28F21/08B64G1/10B64G1/66
CPCB64G1/10B64G1/66F28D15/0283F28D15/046F28F9/0075F28F9/26F28F21/081
Inventor 董丽宁雷智博阮世庭曹建光刘冈云张济民陈钢王江
Owner SHANGHAI SATELLITE ENG INST
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