Glass composition with low thermal expansion coefficient, and glass fiber manufactured therefrom

Abstract

The invention discloses a glass composition with a low thermal expansion coefficient. The glass composition is characterized in that the glass composition comprises a main body material, a reinforcing material and a fluxing material; the main body material comprises silicon oxide, and the weight percentage of the silicon oxide is 55-66% of that of the glass composition; the reinforcing material comprises aluminum oxide, and the weight percentage of the aluminum oxide is 10-20% of that of the glass composition; the fluxing material comprises magnesium oxide, zinc oxide and titanium dioxide; and the weight of the magnesium oxide is 3-12% of that of the glass composition, the weight percentage of the zinc oxide is 0.01-7% of that of the glass composition, and the weight percentage of the titanium dioxide is 0.01-6% of that of the glass composition. The glass composition disclosed by the invention can have a lower thermal expansion coefficient and better mass production performance, and meets the strict requirements of future high-end electronic products.

Description

technical field [0001] The invention relates to the field of glass manufacture, in particular to a glass composition with a low thermal expansion coefficient and the glass fiber produced therefrom. Background technique [0002] With the advancement of wired and wireless network technology, and people's electronic devices (such as: smart phones, tablet computers, video game consoles, smart watches, servers, fidelity wireless headsets, etc.) toward multi-functional, high-speed, high-frequency Various electronic devices with different functions are gradually being developed and marketed; in order to increase the operating speed and frequency of electronic devices, it is often necessary to use materials with low dielectric coefficient (Low Dk) and low dissipation factor (Low Df) to manufacture Circuit board (PCB) to meet the specification of electrical characteristics. [0003] Because the carrier board is the interface between the chip (IC) and the circuit board, it has obviou...

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Problems solved by technology

[0009] Compared with S-Glass and D-Glass glass fibers in the prior art, the glass composition disclosed in the present invention has better thermal expansion coefficient and viscosity temperature of melting point, in order to effectively solve the problems of insufficient thermal expansion coefficient and excessive viscosity Problems, poor performance of glass mass production

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