Preparation method of filled-type thermally conductive silicone rubber composite material

A technology of thermally conductive silicone rubber and composite materials, applied in the field of preparation of high thermal conductivity composite materials, can solve the problems of poor component effect, large thermal expansion coefficient, small thermal conductivity, etc., to prevent moisture, small thermal expansion coefficient, and improve thermal conductivity. Effect

Active Publication Date: 2009-12-09
GUANGDONG SUNLITE MATERIAL SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome many deficiencies in existing high thermal conductivity composite materials such as small thermal conductivity, large thermal expansion coefficient, and poor effect of stabilizing components, the invention provides a method for preparing a filled thermally conductive silicone rubber composite material. The product can effective

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] Example 1:

[0026] (1) Mix 50 parts by mass of carbon-coated copper nanoparticles with 95% ethanol solution and stir, dry at 120°C for 10 hours, then at 150°C for 1 hour, and put them in a desiccator for later use.

[0027] (2) Add 100 parts by mass of raw silicone rubber to the roller. After the raw rubber is wrapped with the roll, add 50 parts by mass of thermally conductive filler and 1 to 3 parts by mass of hydroxy silicone oil. Repeated mixing on the roller for about 40 minutes to uniformity, thin pass 5 to 10 times. Adding 2.5 parts by mass of the vulcanizing agent double 25, then mixing uniformly, and thinly pass the sheet to obtain a silicone rubber compound.

[0028] (3) Put the mixed silicone rubber into the mold, after cold-pressing and filling the mold, place the mold on a flat vulcanizer for one stage of vulcanization. The first stage of vulcanization temperature is: 170℃±10℃, pressure is 14MPa~16Mpa, vulcanization Under the condition of time 5min~10min, vulca...

Example Embodiment

[0031] Example 2:

[0032] (1) Mix 100 parts by mass of carbon-coated copper nanoparticles with 95% ethanol solution and stir, dry at 120°C for 10 hours, and then at 150°C for 1 hour, and put them in a desiccator for later use.

[0033] (2) Add 100 parts by mass of raw silicone rubber to the roller. After the raw rubber is wrapped with the roller, add 100 parts by mass of thermally conductive filler and 1.5 parts by mass of hydroxy silicone oil. Repeated mixing on the roller until uniform, thin pass 5 to 10 times. Adding 2.5 parts by mass of the vulcanizing agent double 25, then mixing uniformly, and thinly pass the sheet to obtain a silicone rubber compound.

[0034](3) Put the mixed silicone rubber into the mold, after cold-pressing and filling the mold, place the mold on a flat vulcanizer for one stage of vulcanization. The first stage of vulcanization temperature is: 170℃±10℃, pressure is 14MPa~16Mpa, vulcanization Under the condition of time 5min~10min, vulcanization molding ...

Example Embodiment

[0037] Example 3:

[0038] (1) Mix 150 parts by mass of carbon-coated copper nanoparticles with 95% ethanol solution and stir, dry at 120°C for 10 hours, then at 150°C for 1 hour, and put them in a desiccator for later use.

[0039] (2) Add 100 parts by mass of raw silicone rubber to the roller. After the raw rubber is wrapped with the roller, 150 parts by mass of thermally conductive filler and 1 to 3 parts by mass of hydroxy silicone oil are added. Repeatedly kneading on the roller until uniform, thinly pass 5 to 10 times. Add 2.5 parts by mass of the vulcanizing agent double 25, then mix evenly, and thinly pass the sheet to obtain a silicone rubber compound.

[0040] (3) Put the mixed silicone rubber into the mold, after cold-pressing and filling the mold, place the mold on a flat vulcanizer for one stage of vulcanization. The first stage of vulcanization temperature is: 170℃±10℃, pressure is 14MPa~16Mpa, vulcanization Under the condition of time 5min~10min, vulcanization moldi...

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PUM

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Abstract

The invention discloses a preparation method of a filled-type thermally conductive silicone rubber composite material. The processing steps of the method are as follows: 1) using alcohol solution to mix carbon-encapsulated copper nanoparticles evenly, and then drying the nanoparticles to prepare dry powder; 2) adding the raw silicone rubber onto a roller, after the raw rubber covers the roller, adding carbon-encapsulated copper nanoparticles dry powder and hydroxy silicone oil in sequence in accordance with the formulation design amounts; mixing the dry powder and the hydroxy silicone oil on the roller repeatedly until being uniform, then adding a vulcanizing agent, and then mixing the mixture uniformly, thin-passing a lower sheet to obtain the silicon rubber compound; 3) putting mixed silicone rubber into a mold, carrying out first vulcanization after cold pressing and mold filling; 4) putting a vulcanization-molded sample on a glass cloth and carrying out post vulcanization on the sample in an air dry oven to obtain finished products. The invention mixes the carbon-encapsulated copper nanoparticles and high-temperature silicone rubber to ensure that the carbon-encapsulated copper nanoparticles are evenly scattered in the silicone rubber substrate to form an integral thermally conductive network chain, thereby improving the thermal conductivity of the silicone rubber.

Description

technical field [0001] The invention relates to a preparation method of a high thermal conductivity composite material, in particular to a preparation process of a high thermal conductivity filled silicone rubber composite material suitable for potting and packaging of electronic components. Background technique [0002] With the development of science and technology, electronic devices are becoming more and more dense and miniaturized, which puts forward higher requirements for the stability of electronic devices. In order to prevent the intrusion of moisture, dust and harmful gases to electronic components, slow down vibration, prevent external force and stabilize components. To minimize the adverse effects of the outside world, electronic components need to be potted and installed. Since the miniaturization of electronic devices has resulted in high power per unit area, if the heat generated by electronic devices cannot be dissipated immediately, it is easy to form a loc...

Claims

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Application Information

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IPC IPC(8): C08L83/00C08L83/06C08K9/02C08K5/14C08J3/24C08L83/07B29C35/02
Inventor 陈伟燕张海燕李丽萍陈福林于日志
Owner GUANGDONG SUNLITE MATERIAL SCI & TECH
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