Packaging structure and packaging method thereof, and display device

A technology of packaging structure and packaging method, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of inability to simultaneously isolate water and oxygen erosion and evacuate the heat of devices, and avoid poor thermal conductivity, poor performance and poor performance. Structural stability and anti-erosion effect

Pending Publication Date: 2021-07-16
TCL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a packaging structure, which aims to solve the technical problems that the existing d

Method used

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  • Packaging structure and packaging method thereof, and display device
  • Packaging structure and packaging method thereof, and display device
  • Packaging structure and packaging method thereof, and display device

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0061] Example 1

[0062] A display device, comprising the steps of:

[0063] ① providing a device to be packaged formed on the substrate, depositing an aluminum nitride film layer on the surface of the device to be packaged away from the substrate to form a protective layer with a thickness of 100 to 500 nanometers;

[0064] ② Depositing graphene nanosheets with a height of 10 to 50 nanometers on the surface of the protective layer away from the device to be packaged, so that the graphene nanosheets are arranged perpendicular to the protective layer, forming a density of 50 to 300 pieces / micron 2 heat dissipation layer;

[0065] ③ Deposit Al first on the surface of the heat dissipation layer away from the protective layer 2 o 3 film layer, forming a first inorganic barrier layer with a thickness of 100 to 200 nanometers, and then depositing polyethylene terephthalate on the surface of the first inorganic barrier layer to form an organic barrier layer with a thickness of 20...

Example Embodiment

[0066] Example 2

[0067] A display device, comprising the steps of:

[0068] ① Provide a substrate containing the same device to be packaged as in Example 1, and deposit an aluminum nitride film layer on the surface of the device to be packaged away from the substrate to form a protective layer with a thickness of 100 to 500 nanometers;

[0069]② Depositing boron nitride nanosheets with a height of 10 to 50 nanometers on the surface of the protective layer away from the device to be packaged, so that the boron nitride nanosheets are arranged perpendicular to the protective layer, and the formation density is 50 to 300 / Micron 2 heat dissipation layer;

[0070] ③ Deposit Al first on the surface of the heat dissipation layer away from the protective layer 2 o 3 film layer, forming a first inorganic barrier layer with a thickness of 100 to 200 nanometers, and then depositing polyethylene terephthalate on the surface of the first inorganic barrier layer to form an organic ba...

Example Embodiment

[0071] Example 3

[0072] A display device, comprising the steps of:

[0073] ① Provide a substrate containing the same device to be packaged as in Example 1, and deposit an aluminum nitride film layer on the surface of the device to be packaged away from the substrate to form a protective layer with a thickness of 100 to 500 nanometers;

[0074] ② Depositing graphene nanosheets and boron nitride nanosheets with a height of 10 to 50 nanometers on the surface of the protective layer away from the device to be packaged, so that the graphene nanosheets and boron nitride nanosheets are perpendicular to the protective layer Set, forming a density of 50 to 300 / micron 2 heat dissipation layer;

[0075] ③ Deposit Al first on the surface of the heat dissipation layer away from the protective layer 2 o 3 film layer, forming a first inorganic barrier layer with a thickness of 100 to 200 nanometers, and then depositing polyethylene terephthalate on the surface of the first inorganic...

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Abstract

The invention belongs to the technical field of display device packaging, and particularly relates to a packaging structure, which comprises a protective layer, a barrier layer and a heat dissipation layer arranged between the protective layer and the barrier layer, wherein the heat dissipation layer comprises a graphene nanosheet and/or a boron nitride nanosheet. According to the invention, the packaging structure can effectively isolate corrosion of oxygen, water and other components in air to the display device, has good heat dissipation performance, can timely conduct and evacuate heat generated in the use process of the display device, and prevents low luminous efficiency and too fast service life degradation of the display device caused by heat accumulation, so that the display device has more stable photoelectric performance and longer service life.

Description

technical field [0001] The invention belongs to the technical field of display device packaging, and in particular relates to a packaging structure and a packaging method thereof, and a display device. Background technique [0002] Electroluminescent display devices based on organic or inorganic materials, such as quantum dot light emitting diodes (Quantumdot Light Emitting Diode, QLED) and organic light emitting diodes (Organic Light Emitting Diode, OLED), are self-illuminating, do not require a backlight module, and have a wide viewing angle , Contrast and high definition, full curing, suitable for flexible panels, good temperature characteristics, fast response speed, energy saving and environmental protection, etc., have become a research hotspot and key development direction of new display technology. However, the display device is easily corroded by oxygen, water and other components in the air, which seriously affects the service life of the device. Therefore, it is u...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/50H01L27/32
CPCH10K59/00H10K50/115H10K50/84H10K50/87
Inventor 王劲杨一行
Owner TCL CORPORATION
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